Inventor · disambiguated record
Jeffory L. Smalley
Also filed as: SMALLEY JEFFORY · SMALLEY JEFFORY L
38 granted patents·34 pending applications·108 citations·filing 2010–2025
96Inventor score
Top patents by PatentIndex Score
72 records- 0194US10880994B2Top-side connector interface for processor packagingINTEL CORP·Filed 2016·Granted Dec 29, 2020·13 cites·13 claims
- 0291US10455685B1Electronic device, socket, and spacer to alter socket profileINTEL CORP·Filed 2018·Granted Oct 22, 2019·12 cites·20 claims
- 0391US9265170B2Integrated circuit connectorsINTEL CORP·Filed 2013·Granted Feb 16, 2016·13 cites·10 claims
- 0490US9490560B2Multi-array bottom-side connector using spring biasINTEL CORP·Filed 2014·Granted Nov 8, 2016·10 cites·20 claims
- 0588US11449111B2Scalable, high load, low stiffness, and small footprint loading mechanismINTEL CORP·Filed 2018·Granted Sep 20, 2022·6 cites·15 claims
- 0687US9832876B2CPU package substrates with removable memory mechanical interfacesINTEL CORP·Filed 2014·Granted Nov 28, 2017·7 cites·36 claims
- 0781US9935033B2Heat sink coupling using flexible heat pipes for multi-surface componentsINTEL CORP·Filed 2015·Granted Apr 3, 2018·4 cites·10 claims
- 0881US9681556B2Contact protection for integrated circuit device loadingLLAPITAN DAVID J·Filed 2012·Granted Jun 13, 2017·6 cites·28 claims
- 0980US10418309B1Mechanical seal and reservoir for microelectronic packagesINTEL CORP·Filed 2018·Granted Sep 17, 2019·3 cites·20 claims
- 1080US9806003B2Single base multi-floating surface cooling solutionINTEL CORP·Filed 2016·Granted Oct 31, 2017·3 cites·14 claims
- 1179US8405966B2Memory carrier and IHS coupling systemHARTMAN COREY D·Filed 2010·Granted Mar 26, 2013·7 cites·20 claims
- 1278US8279596B2Fan mounting systemRODRIGUEZ ALEJANDRO Z·Filed 2010·Granted Oct 2, 2012·9 cites·20 claims
- 1376US12131977B2Electronic systems with inverted circuit board with heat sink to chassis attachmentINTEL CORP·Filed 2023·Granted Oct 29, 2024·0 cites·20 claims
- 1473US9780510B2Socket contact techniques and configurationsINTEL CORP·Filed 2014·Granted Oct 3, 2017·3 cites·11 claims
- 1569US10205292B2Socket contact techniques and configurationsINTEL CORP·Filed 2017·Granted Feb 12, 2019·1 cites·20 claims
- 1669US9848510B2Socket loading element and associated techniques and configurationsINTEL CORP·Filed 2014·Granted Dec 19, 2017·2 cites·20 claims
- 1767US9385444B2Lateral slide pick and place cover for reduced bent pins in LGA socketsINTEL CORP·Filed 2013·Granted Jul 5, 2016·2 cites·17 claims
- 1866US9603276B2Electronic assembly that includes a plurality of electronic packagesINTEL CORP·Filed 2014·Granted Mar 21, 2017·1 cites·22 claims
- 1966US2025234478A1Patterned bolster plate and composite back plate for semiconductor chip lga package and cooling assembly retentionINTEL CORP·Filed 2025·Application pending·0 cites
- 2065US12453054B2Cooling assembly with strap element to diminish lateral movement of cooling mass during installation of the cooling massINTEL CORP·Filed 2022·Granted Oct 21, 2025·0 cites·20 claims
- 2165US12444664B2Loading frame for high I/O count packaged semiconductor chipSK HYNIX NAND PRODUCT SOLUTIONS CORP·Filed 2020·Granted Oct 14, 2025·0 cites·20 claims
- 2265US11683890B2Reflow grid array to support late attach of componentsINTEL CORP·Filed 2018·Granted Jun 20, 2023·1 cites·24 claims
- 2365US9859636B2Linear edge connector with activator bar and contact load springINTEL CORP·Filed 2015·Granted Jan 2, 2018·2 cites·19 claims
- 2463US12476167B2Semiconductor chip package thermo-mechanical cooling assemblyINTEL CORP·Filed 2022·Granted Nov 18, 2025·0 cites·18 claims
- 2563US12279395B2Patterned bolster plate and composite back plate for semiconductor chip LGA package and cooling assembly retentionINTEL CORP·Filed 2021·Granted Apr 15, 2025·0 cites·14 claims
- 2663US11842943B2Electronic systems with inverted circuit board with heat sink to chassis attachmentINTEL CORP·Filed 2020·Granted Dec 12, 2023·0 cites·22 claims
- 2761US2025089192A1Composite backplate architectures for backside power delivery and associated methodsINTEL CORP·Filed 2024·Application pending·0 cites
- 2860US11495518B2Multi-surface heat sink suitable for multi-chip packagesINTEL CORP·Filed 2019·Granted Nov 8, 2022·1 cites·16 claims
- 2960US2025024622A1Protrusions of socket bodies having metalINTEL CORP·Filed 2024·Application pending·0 cites
- 3059US2021120668A1Top-side connector interface for processor packagingINTEL CORP·Filed 2020·Application pending·0 cites
- 3159US2025071924A1Tall DIMM Structural RetentionINTEL CORP·Filed 2024·Application pending·0 cites
- 3258US2025174922A1Damping elements for pin vibration fretting risk mitigationINTEL CORP·Filed 2023·Application pending·0 cites
- 3357US12506083B2Liquid metal interconnect for modular package server architectureINTEL CORP·Filed 2021·Granted Dec 23, 2025·0 cites·20 claims
- 3457US2025112392A1Semiconductor package carrier, and a corresponding system and method of useINTEL CORP·Filed 2024·Application pending·0 cites
- 3557US2024096741A1Cooling systems with main and remote cooling masses having integrated flexibilityINTEL CORP·Filed 2023·Application pending·0 cites
- 3657US2024355702A1Integrated circuit packages with dampeners to reduce vibration effectsGENG PHIL·Filed 2024·Application pending·0 cites
- 3757US2024357744A1Integrated circuit packages including carriers with incorporated substrates and interfacesINTEL CORP·Filed 2024·Application pending·0 cites
- 3856US2015184053A1Gasketted thermal interfaceKRISHNAN SHANKAR·Filed 2013·Application pending·0 cites
- 3955US9325087B2Electronic assemblies with scalable clip-type connectorsCHAWLA GAURAV·Filed 2014·Granted Apr 26, 2016·2 cites·25 claims
- 4055US2023038805A1Methods, systems, apparatus, and articles of manufacture to control load distribution of integrated circuit packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 4155US2024179832A1Multi-entry socket power delivery structure and backplateGENG PHIL·Filed 2024·Application pending·0 cites
- 4254US12315780B2Technologies for processor loading mechanismsINTEL CORP·Filed 2021·Granted May 27, 2025·0 cites·10 claims
- 4353US12494435B2Liquid metal interconnect for modular system on an interposer server architectureINTEL CORP·Filed 2021·Granted Dec 9, 2025·0 cites·22 claims
- 4453US12309933B2Magnetically secured semiconductor chip package loading assemblyINTEL CORP·Filed 2021·Granted May 20, 2025·0 cites·20 claims
- 4553US11545408B2Reflowable grid array to support grid heatingINTEL CORP·Filed 2019·Granted Jan 3, 2023·0 cites·24 claims
- 4653US2023395460A1Backside integrated torsion loading mechanismINTEL CORP·Filed 2023·Application pending·0 cites
- 4752US2018352649A1Connector interface for processor packagingINTEL CORP·Filed 2016·Application pending·0 cites
- 4852US2023019643A1Integrated separator devices for hardware component separationINTEL CORP·Filed 2022·Application pending·0 cites
- 4952US2024349457A1Damping assemblies for heat sinks and related methodsGENG PHIL·Filed 2024·Application pending·0 cites
- 5051US2022117079A1Cooling assembly with dampened oscillation responseINTEL CORP·Filed 2021·Application pending·0 cites
Showing the top 50 of 72 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →