Inventor · disambiguated record
Kuang Liu
Also filed as: LIU KUANG · LIU KUANG C · LIU KUANG-CHUAN
19 granted patents·5 pending applications·41 citations·filing 2013–2023
91Inventor score
Top patents by PatentIndex Score
24 records- 0192US12238892B2Immersion cooling for integrated circuit devicesINTEL CORP·Filed 2020·Granted Feb 25, 2025·3 cites·15 claims
- 0291US10455685B1Electronic device, socket, and spacer to alter socket profileINTEL CORP·Filed 2018·Granted Oct 22, 2019·12 cites·20 claims
- 0387US9832876B2CPU package substrates with removable memory mechanical interfacesINTEL CORP·Filed 2014·Granted Nov 28, 2017·7 cites·36 claims
- 0482US11464139B2Conformable heat sink interface with a high thermal conductivityINTEL CORP·Filed 2018·Granted Oct 4, 2022·3 cites·20 claims
- 0580US11291133B2Selective ground flood around reduced land pad on package base layer to enable high speed land grid array (LGA) socketINTEL CORP·Filed 2018·Granted Mar 29, 2022·2 cites·25 claims
- 0679US9825387B2Linear edge connector with a cable retention mechanism having a body with a groove with an indentation to receive a bolster plate protrusionINTEL CORP·Filed 2016·Granted Nov 21, 2017·3 cites·17 claims
- 0774US11737227B2Selective ground flood around reduced land pad on package base layer to enable high speed land grid array (LGA) socketINTEL CORP·Filed 2022·Granted Aug 22, 2023·0 cites·25 claims
- 0874US9615483B2Techniques and configurations associated with a package load assemblyINTEL CORP·Filed 2014·Granted Apr 4, 2017·3 cites·21 claims
- 0974US9194991B2Fiber optic sensor manufacturing method and structure thereofCHIANG CHIA-CHIN·Filed 2013·Granted Nov 24, 2015·5 cites·18 claims
- 1066US9603276B2Electronic assembly that includes a plurality of electronic packagesINTEL CORP·Filed 2014·Granted Mar 21, 2017·1 cites·22 claims
- 1164US9647363B2Techniques and configurations to control movement and position of surface mounted electrical devicesINTEL CORP·Filed 2014·Granted May 9, 2017·1 cites·11 claims
- 1263US12127363B2Compression mounted technology (CMT) socket retention mechanisms to board or interposerINTEL CORP·Filed 2020·Granted Oct 22, 2024·0 cites·25 claims
- 1354US11569596B2Pressure features to alter the shape of a socketINTEL CORP·Filed 2020·Granted Jan 31, 2023·0 cites·17 claims
- 1453US10044115B2Universal linear edge connectorINTEL CORP·Filed 2015·Granted Aug 7, 2018·1 cites·7 claims
- 1552US2025112163A1Through-glass via liners for integrated circuit device packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 1651US12009612B2Dual-sided socket device with corrugation structures and shield structuresINTEL CORP·Filed 2020·Granted Jun 11, 2024·0 cites·20 claims
- 1751US10499461B2Thermal head with a thermal barrier for integrated circuit die processingINTEL CORP·Filed 2015·Granted Dec 3, 2019·0 cites·13 claims
- 1850US10186497B2Techniques and configurations to control movement and position of surface mounted electrical devicesINTEL CORP·Filed 2017·Granted Jan 22, 2019·0 cites·17 claims
- 1949US2018007791A1Cpu package substrates with removable memory mechanical interfacesINTEL CORP·Filed 2017·Application pending·0 cites
- 2043US10680367B2Cable retention assemblies including torsional elementsINTEL CORP·Filed 2016·Granted Jun 9, 2020·0 cites·6 claims
- 2142US2019182955A1Replaceable on-package memory devicesINTEL CORP·Filed 2017·Application pending·0 cites
- 2240US2019307010A1Transmission line - land grid array (tl-lga) socket with cascaded transmission line structures for maximum bandwidth and data rateZHANG ZHICHAO·Filed 2018·Application pending·0 cites
- 2338US2016190716A1Socket that engages a plurality of electronic packagesLIU KUANG·Filed 2014·Application pending·0 cites
- 2436US11158969B2Connectors for integrated circuit packagesINTEL CORP·Filed 2018·Granted Oct 26, 2021·0 cites·25 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →