Cpu package substrates with removable memory mechanical interfaces

Abstract

Configurable central processing unit (CPU) package substrates are disclosed. A package substrate is described that includes a processing device interface. The package substrate also includes a memory device electrical interface disposed on the package substrate. The package substrate also includes a removable memory mechanical interface disposed proximately to the memory device electrical interface. The removable memory mechanical interface is to allow a memory device to be easily removed from the package substrate after attachment of the memory device to the package substrate.

What is claimed is: 
     
         1 . A package substrate, comprising:
 a processing device interface;   a memory device electrical interface disposed on the package substrate;   a removable memory mechanical interface disposed proximately to the memory device electrical interface, the removable memory mechanical interface to allow a memory device to be easily removed from the package substrate after attachment of the memory device to the package substrate, wherein the removable memory mechanical interface is a multi-edge connector socket.   
     
     
         2 . The package substrate of  claim 1 , wherein the memory device electrical interface comprises a land grid array. 
     
     
         3 . The package substrate of  claim 1 , wherein the memory device electrical interface comprises an array of pins. 
     
     
         4 . The package substrate of  claim 1 , wherein the multi-edge connector socket is a double edge socket comprising:
 a first portion and a second portion connected at a joint, the first portion extending in a direction at an offset angle from the second portion;   an opening extending through the joint and along both the first and second portions; and   an array of contacts extending in a direction at an angle half of the offset angle from one of the first and second portion.   
     
     
         5 . The package substrate of  claim 4 , wherein the first and second portions have a beveled corner that extends in a direction parallel to the array of contacts. 
     
     
         6 . The package substrate of  claim 1 , wherein the multi-edge connector socket is a full edge pin grid array socket, comprising:
 a structure body in the shape of a frame; and   a plurality of openings in a top surface of the structure body.   
     
     
         7 . A package system, comprising:
 a package substrate;   a processing device coupled to the package substrate;   a memory device electrical interface disposed on the package substrate;   a removable memory mechanical interface disposed proximate to the memory device electrical interface, wherein the removable memory mechanical interface is a multi-edge connector socket; and   a memory device attached to the memory device electrical interface by the removable memory mechanical interface, the removable memory device mechanical interface to permit the memory device to be easily detachable and re-attachable to the memory device electrical interface.   
     
     
         8 . The package system of  claim 7 , wherein the memory device is electrically coupled to the processing device on the package substrate. 
     
     
         9 . A method of fabricating a package system, comprising:
 attaching a processing device to a package substrate; and   attaching a memory device to the package substrate by attaching a memory device substrate to a removable memory mechanical interface disposed on the package substrate around a memory device electrical interface, wherein the removable memory mechanical interface is a multi-edge connector socket.   
     
     
         10 . The method of  claim 9 , wherein the memory device substrate is attached by inserting the memory device substrate into a socket of the removable memory mechanical interface. 
     
     
         11 . A multi-edge connector, comprising:
 a substrate having at least two edges that are joined at one end, the two edges forming a separation angle with respect to one another;   a single connection interface continuously extending along at least the two edges; and   a plurality of pads on the connection interface, each pad of the plurality of pads extending in a direction at an angle half of the separation angle from one of the at least two edges.   
     
     
         12 . The multi-edge connector of  claim 11 , further comprising a beveled edge disposed on a corner of the substrate, the beveled edge extending in a direction parallel to the plurality of pads.