Inventor · disambiguated record
Gregorio R. Murtagian
Also filed as: MURTAGIAN GREGORIO · MURTAGIAN GREGORIO R · MURTAGIAN GREGORIO ROBERTO
20 granted patents·16 pending applications·30 citations·filing 2012–2024
91Inventor score
Top patents by PatentIndex Score
36 records- 0189US10056182B2Surface-mount inductor structures for forming one or more inductors with substrate tracesINTEL CORP·Filed 2015·Granted Aug 21, 2018·7 cites·9 claims
- 0287US9832876B2CPU package substrates with removable memory mechanical interfacesINTEL CORP·Filed 2014·Granted Nov 28, 2017·7 cites·36 claims
- 0385US9692147B1Small form factor sockets and connectorsINTEL CORP·Filed 2015·Granted Jun 27, 2017·5 cites·11 claims
- 0484US10431912B2CPU socket contact for improving bandwidth throughputINTEL CORP·Filed 2017·Granted Oct 1, 2019·6 cites·25 claims
- 0580US11291133B2Selective ground flood around reduced land pad on package base layer to enable high speed land grid array (LGA) socketINTEL CORP·Filed 2018·Granted Mar 29, 2022·2 cites·25 claims
- 0674US11737227B2Selective ground flood around reduced land pad on package base layer to enable high speed land grid array (LGA) socketINTEL CORP·Filed 2022·Granted Aug 22, 2023·0 cites·25 claims
- 0766US9603276B2Electronic assembly that includes a plurality of electronic packagesINTEL CORP·Filed 2014·Granted Mar 21, 2017·1 cites·22 claims
- 0864US2025374423A1Electronic device carrier structures including polymer layers as barriers to solid state solder diffusion and methods of forming the sameGEORGIA TECH RES INST·Filed 2024·Application pending·0 cites
- 0963US12174436B2Package expanded beam connector for on-package opticsINTEL CORP·Filed 2021·Granted Dec 24, 2024·0 cites·25 claims
- 1059US2025079262A1Methods and apparatus for multi-zone temperature control of jet impingement cooling of integrated circuit packagesINTEL CORP·Filed 2024·Application pending·0 cites
- 1157US12506083B2Liquid metal interconnect for modular package server architectureINTEL CORP·Filed 2021·Granted Dec 23, 2025·0 cites·20 claims
- 1257US12207398B2Electronic device carrier structures including polymer layers as barriers to solid state solder diffusion and methods of forming the sameGEORGIA TECH RES INST·Filed 2022·Granted Jan 21, 2025·0 cites·19 claims
- 1357US2025110173A1Methods, systems, articles of manufacture, and apparatus for improved thermal tests of integrated circuit devicesINTEL CORP·Filed 2023·Application pending·0 cites
- 1457US2025149414A1Low z-height separable liquid metal based electrical interconnectINTEL CORP·Filed 2023·Application pending·0 cites
- 1555US2025208190A1Title direct fluid cooling with multi temperature controlINTEL CORP·Filed 2023·Application pending·0 cites
- 1654US2024388018A1Liquid metal patch interconnect for large warpage componentsINTEL CORP·Filed 2023·Application pending·0 cites
- 1753US12494435B2Liquid metal interconnect for modular system on an interposer server architectureINTEL CORP·Filed 2021·Granted Dec 9, 2025·0 cites·22 claims
- 1853US10044115B2Universal linear edge connectorINTEL CORP·Filed 2015·Granted Aug 7, 2018·1 cites·7 claims
- 1953US9860988B2Solder contacts for socket assembliesINTEL CORP·Filed 2014·Granted Jan 2, 2018·0 cites·24 claims
- 2052US2025208197A1Multi zone temperature control for devices under testINTEL CORP·Filed 2023·Application pending·0 cites
- 2151US11818832B2Socket load regulation utilizing CPU carriers with shim componentsINTEL CORP·Filed 2020·Granted Nov 14, 2023·0 cites·7 claims
- 2251US10321573B2Solder contacts for socket assembliesINTEL CORP·Filed 2017·Granted Jun 11, 2019·0 cites·22 claims
- 2350US2023314503A1Technologies for testing liquid metal array interconnect packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 2449US11804456B2Wirebond and leadframe magnetic inductorsINTEL CORP·Filed 2018·Granted Oct 31, 2023·0 cites·17 claims
- 2549US2023187850A1Liquid metal connection device and methodINTEL CORP·Filed 2021·Application pending·0 cites
- 2649US2018007791A1Cpu package substrates with removable memory mechanical interfacesINTEL CORP·Filed 2017·Application pending·0 cites
- 2748US2023187337A1Flexible liquid metal connection device and methodMeyyappan Karumbu·Filed 2021·Application pending·0 cites
- 2846US2023317533A1Technologies for liquid metal mixtures for electrical interconnectsINTEL CORP·Filed 2022·Application pending·0 cites
- 2945US10522450B1Pillar based socketINTEL CORP·Filed 2018·Granted Dec 31, 2019·0 cites·20 claims
- 3045US9461431B2Mechanism for facilitating and employing a magnetic grid arrayINTEL CORP·Filed 2015·Granted Oct 4, 2016·0 cites·6 claims
- 3143US10396036B2Rlink-ground shielding attachment structures and shadow voiding for data signal contacts of package devices; vertical ground shielding structures and shield fencing of vertical data signal interconnects of package devices; and ground shielding for electro optical module connector data signal contacts and contact pins of package devicesINTEL CORP·Filed 2015·Granted Aug 27, 2019·0 cites·20 claims
- 3243US2014167900A1Surface-mount inductor structures for forming one or more inductors with substrate tracesMURTAGIAN GREGORIO R·Filed 2012·Application pending·0 cites
- 3342US9118143B2Mechanism for facilitating and employing a magnetic grid arrayMURTAGIAN GREGORIO R·Filed 2012·Granted Aug 25, 2015·1 cites·10 claims
- 3442US2019182955A1Replaceable on-package memory devicesINTEL CORP·Filed 2017·Application pending·0 cites
- 3541US2020335432A1Chip mounting techniques to reduce circuit board deflectionINTEL CORP·Filed 2019·Application pending·0 cites
- 3638US2016190716A1Socket that engages a plurality of electronic packagesLIU KUANG·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →