Inventor · disambiguated record
Ram Viswanath
Also filed as: VISWANATH RAM · VISWANATH RAM S
47 granted patents·10 pending applications·636 citations·filing 1997–2025
98Inventor score
Top patents by PatentIndex Score
57 records- 0197US11302643B2Microelectronic component having molded regions with through-mold viasINTEL CORP·Filed 2020·Granted Apr 12, 2022·5 cites·19 claims
- 0297US11270942B2Pitch translation architecture for semiconductor package including embedded interconnect bridgeINTEL CORP·Filed 2020·Granted Mar 8, 2022·4 cites·17 claims
- 0396US12176292B2Microelectronic component having molded regions with through-mold viasINTEL CORP·Filed 2023·Granted Dec 24, 2024·2 cites·20 claims
- 0496US12051647B2Pitch translation architecture for semiconductor package including embedded interconnect bridgeINTEL CORP·Filed 2023·Granted Jul 30, 2024·2 cites·17 claims
- 0596US11705398B2Pitch translation architecture for semiconductor package including embedded interconnect bridgeINTEL CORP·Filed 2022·Granted Jul 18, 2023·3 cites·17 claims
- 0695US11817390B2Microelectronic component having molded regions with through-mold viasINTEL CORP·Filed 2022·Granted Nov 14, 2023·2 cites·20 claims
- 0794US12261150B2Mold shelf package design and process flow for advanced package architecturesINTEL CORP·Filed 2023·Granted Mar 25, 2025·1 cites·20 claims
- 0894US12087731B2No mold shelf package design and process flow for advanced package architecturesINTEL CORP·Filed 2023·Granted Sep 10, 2024·1 cites·18 claims
- 0994US9129958B23D integrated circuit package with window interposerMALLIK DEBENDRA·Filed 2011·Granted Sep 8, 2015·17 cites·24 claims
- 1093US11557541B2Interconnect architecture with silicon interposer and EMIBINTEL CORP·Filed 2018·Granted Jan 17, 2023·6 cites·25 claims
- 1193US5944093APickup chuck with an integral heat pipeINTEL CORP·Filed 1997·Granted Aug 31, 1999·138 cites·12 claims
- 1291US9265170B2Integrated circuit connectorsINTEL CORP·Filed 2013·Granted Feb 16, 2016·13 cites·10 claims
- 1391US8513792B2Package-on-package interconnect stiffenerGANESAN SANKA·Filed 2009·Granted Aug 20, 2013·20 cites·18 claims
- 1490US10187996B2Printed circuit board with a recess to accommodate discrete components in a packageINTEL CORP·Filed 2017·Granted Jan 22, 2019·6 cites·19 claims
- 1587US12388019B2Pitch translation architecture for semiconductor package including embedded interconnect bridgeINTEL CORP·Filed 2024·Granted Aug 12, 2025·0 cites·20 claims
- 1687US11935808B2IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnectsINTEL CORP·Filed 2020·Granted Mar 19, 2024·2 cites·22 claims
- 1787US9832876B2CPU package substrates with removable memory mechanical interfacesINTEL CORP·Filed 2014·Granted Nov 28, 2017·7 cites·36 claims
- 1887US2025070030A1Microelectronic component having molded regions with through-mold viasINTEL CORP·Filed 2024·Application pending·0 cites
- 1986US6189601B1Heat sink with a heat pipe for spreading of heatINTEL CORP·Filed 1999·Granted Feb 20, 2001·163 cites·17 claims
- 2086US6019166APickup chuck with an integral heatsinkINTEL CORP·Filed 1997·Granted Feb 1, 2000·79 cites·14 claims
- 2183US10643945B2Pitch translation architecture for semiconductor package including embedded interconnect bridgeINTEL CORP·Filed 2017·Granted May 5, 2020·2 cites·20 claims
- 2283US2025226323A1Microelectronic component having molded regions with through-mold viasINTEL CORP·Filed 2025·Application pending·0 cites
- 2381US12347783B2Interconnect architecture with silicon interposer and EMIBINTEL CORP·Filed 2024·Granted Jul 1, 2025·0 cites·20 claims
- 2481US9865568B2Integrated circuit structures with recessed conductive contacts for package on packageINTEL CORP·Filed 2015·Granted Jan 9, 2018·3 cites·20 claims
- 2580US11574851B2Coupled cooling fins in ultra-small systemsINTEL CORP·Filed 2019·Granted Feb 7, 2023·3 cites·23 claims
- 2679US11901333B2No mold shelf package design and process flow for advanced package architecturesINTEL CORP·Filed 2019·Granted Feb 13, 2024·1 cites·25 claims
- 2778US11901299B2Interconnect architecture with silicon interposer and EMIBINTEL CORP·Filed 2022·Granted Feb 13, 2024·0 cites·25 claims
- 2878US10784204B2Rlink—die to die channel interconnect configurations to improve signalingINTEL CORP·Filed 2016·Granted Sep 22, 2020·3 cites·22 claims
- 2978US6493223B1Computer utilizing refrigeration for coolingINTEL CORP·Filed 2000·Granted Dec 10, 2002·27 cites·17 claims
- 3078US2025192101A1No mold shelf package design and process flow for advanced package architecturesINTEL CORP·Filed 2025·Application pending·0 cites
- 3177US11640942B2Microelectronic component having molded regions with through-mold viasINTEL CORP·Filed 2022·Granted May 2, 2023·0 cites·20 claims
- 3277US10424561B2Integrated circuit structures with recessed conductive contacts for package on packageINTEL CORP·Filed 2018·Granted Sep 24, 2019·2 cites·25 claims
- 3376US12283535B2IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnectsINTEL CORP·Filed 2023·Granted Apr 22, 2025·0 cites·14 claims
- 3476US9391013B23D integrated circuit package with window interposerINTEL CORP·Filed 2015·Granted Jul 12, 2016·2 cites·22 claims
- 3576US6575766B1Laminated socket contactsINTEL CORP·Filed 2002·Granted Jun 10, 2003·20 cites·22 claims
- 3676US6072322AThermally enhanced test socketINTEL CORP·Filed 1997·Granted Jun 6, 2000·42 cites·32 claims
- 3775US9461014B2Methods of forming ultra thin package structures including low temperature solder and structures formed therbyINTEL CORP·Filed 2015·Granted Oct 4, 2016·2 cites·26 claims
- 3874US9603247B2Electronic package with narrow-factor via including finish layerINTEL CORP·Filed 2014·Granted Mar 21, 2017·3 cites·18 claims
- 3970US9640887B2Low profile zero/low insertion force package top side flex cable connector architectureINTEL CORP·Filed 2016·Granted May 2, 2017·1 cites·6 claims
- 4066US9324678B2Low profile zero/low insertion force package top side flex cable connector architectureGANESAN SANKA·Filed 2011·Granted Apr 26, 2016·4 cites·13 claims
- 4165US6049217AThermally enhanced test contactorINTEL CORP·Filed 1997·Granted Apr 11, 2000·27 cites·20 claims
- 4264US6888722B2Thermal design for minimizing interface in a multi-site thermal contact conditionINTEL CORP·Filed 2003·Granted May 3, 2005·11 cites·9 claims
- 4363US9064971B2Methods of forming ultra thin package structures including low temperature solder and structures formed therbyINTEL CORP·Filed 2012·Granted Jun 23, 2015·1 cites·16 claims
- 4460US9674954B2Chip package connector assemblyINTEL CORP·Filed 2013·Granted Jun 6, 2017·3 cites·17 claims
- 4558US2025006643A1Methods of forming wafer level multi-die system fabric interconnect structuresINTEL CORP·Filed 2023·Application pending·0 cites
- 4654US11984377B2IC die and heat spreaders with solderable thermal interface structures for assemblies including solder array thermal interconnectsINTEL CORP·Filed 2020·Granted May 14, 2024·0 cites·25 claims
- 4750US11923267B2IC die with solderable thermal interface structures for assemblies including solder array thermal interconnectsINTEL CORP·Filed 2020·Granted Mar 5, 2024·0 cites·16 claims
- 4850US2013292838A1Package-on-package interconnect stiffenerGANESAN SANKA·Filed 2013·Application pending·0 cites
- 4950US2023086356A1Glass core substrate including buildups with different numbers of layersINTEL CORP·Filed 2021·Application pending·0 cites
- 5049US6854979B2Laminated socket contactsINTEL CORP·Filed 2002·Granted Feb 15, 2005·3 cites·15 claims
Showing the top 50 of 57 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →