Inventor · disambiguated record
Vijaykumar Krithivasan
Also filed as: KRITHIVASAN VIJAYKUMAR
14 granted patents·8 pending applications·56 citations·filing 2012–2022
90Inventor score
Top patents by PatentIndex Score
22 records- 0191US11122678B2Packaged device having imbedded array of componentsTESLA INC·Filed 2020·Granted Sep 14, 2021·3 cites·14 claims
- 0291US9265170B2Integrated circuit connectorsINTEL CORP·Filed 2013·Granted Feb 16, 2016·13 cites·10 claims
- 0390US9490560B2Multi-array bottom-side connector using spring biasINTEL CORP·Filed 2014·Granted Nov 8, 2016·10 cites·20 claims
- 0490US8905794B2Connector assembly and methodINTEL CORP·Filed 2012·Granted Dec 9, 2014·10 cites·28 claims
- 0583US9385457B2Connector assembly and methodINTEL CORP·Filed 2014·Granted Jul 5, 2016·5 cites·15 claims
- 0676US11973004B2Mechanical architecture for a multi-chip moduleTESLA INC·Filed 2019·Granted Apr 30, 2024·2 cites·9 claims
- 0774US9615483B2Techniques and configurations associated with a package load assemblyINTEL CORP·Filed 2014·Granted Apr 4, 2017·3 cites·21 claims
- 0869US9848510B2Socket loading element and associated techniques and configurationsINTEL CORP·Filed 2014·Granted Dec 19, 2017·2 cites·20 claims
- 0967US9385444B2Lateral slide pick and place cover for reduced bent pins in LGA socketsINTEL CORP·Filed 2013·Granted Jul 5, 2016·2 cites·17 claims
- 1066US10697061B2Two zone flow cooling plate design with concentric or spiral channel for efficient gas distribution assembly coolingAPPLIED MATERIALS INC·Filed 2017·Granted Jun 30, 2020·1 cites·5 claims
- 1166US9603276B2Electronic assembly that includes a plurality of electronic packagesINTEL CORP·Filed 2014·Granted Mar 21, 2017·1 cites·22 claims
- 1255US9325087B2Electronic assemblies with scalable clip-type connectorsCHAWLA GAURAV·Filed 2014·Granted Apr 26, 2016·2 cites·25 claims
- 1355US8961193B2Chip socket including a circular contact patternINTEL CORP·Filed 2012·Granted Feb 24, 2015·2 cites·10 claims
- 1452US2025048561A1Field programmable solder ball grid array with embedded control systemsTESLA INC·Filed 2022·Application pending·0 cites
- 1551US2024061482A1Voltage regulating module design for the use of underfillTESLA INC·Filed 2022·Application pending·0 cites
- 1650US2024145432A1Cooled system-on-wafer with means for reducing the effects of electrostatic discharge and/or electromagnetic interferenceTESLA INC·Filed 2022·Application pending·0 cites
- 1750US2024312863A1Electronic assemblies and methods of manufacturing the sameTESLA INC·Filed 2022·Application pending·0 cites
- 1850US2025087557A1Sandwiched multi-layer structure for cooling high power electronicsTESLA INC·Filed 2022·Application pending·0 cites
- 1947US2024234333A9Wafer alignment structureTESLA INC·Filed 2022·Application pending·0 cites
- 2044US11551905B2Resonant process monitorAPPLIED MATERIALS INC·Filed 2018·Granted Jan 10, 2023·0 cites·20 claims
- 2144US2015162719A1Chip socket including a circular contact patternINTEL CORP·Filed 2015·Application pending·0 cites
- 2238US2016190716A1Socket that engages a plurality of electronic packagesLIU KUANG·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →