Chip socket including a circular contact pattern

Abstract

An apparatus for coupling an integrated circuit to other electronics can include a housing having an exterior and an interior, the exterior having an exterior bottom surface, the interior defined by an interior bottom surface opposite the exterior bottom surface, and at least one sidewall extending away from the interior bottom surface to define an interior shape that is sized to receive the integrated circuit, with the integrated circuit disposed against the interior bottom surface and the at least one sidewall. The example can include a plurality of exterior contacts exposed along the exterior bottom surface in an exterior contact pattern that is generally circular in shape.

What is claimed is: 
     
         1 . A method of forming a socket comprising:
 forming a socket housing comprising:   forming an interior including an interior bottom surface;   forming an exterior bottom surface; and   coupling an array of contacts to the exterior bottom surface to define a generally circular array of contacts.   
     
     
         2 . The method of  claim 1 , wherein forming the housing includes forming an array of contact openings extending from the exterior bottom surface of the housing to the interior bottom surface of the housing. 
     
     
         3 . The method of  claim 2 , wherein coupling an array of contacts to the exterior bottom surface includes disposing the array of contacts into the array of contact openings. 
     
     
         4 . The method of  claim 3 , wherein disposing an array of contacts into the array of contact openings includes disposing an array of compliant contacts extending through the openings. 
     
     
         5 . The method of  claim 4 , wherein disposing an array of compliant contacts extending through the openings includes defining a generally circular interior contact pattern. 
     
     
         6 . The method of  claim 1 , wherein coupling the array of contacts includes press-fitting the array of contacts. 
     
     
         7 . A method of assembling an integrated circuit to a circuit, the method comprising:
 forming a socket housing comprising:   forming an interior including an interior bottom surface;   forming an exterior bottom surface;   forming a generally circular array of contact openings extending along the exterior bottom surface to the exterior bottom surface; and   disposing an array of compliant contacts into the array of contact openings;   coupling the socket housing to the circuit; and   inserting the integrated circuit into the housing.   
     
     
         8 . The method of  claim 7 , wherein inserting the integrated circuit includes actuating a low insertion force mechanism. 
     
     
         9 . The method of  claim 7 , wherein coupling the socket housing to the circuit includes soldering the socket housing to the circuit. 
     
     
         10 . The method of  claim 7 , wherein inserting the integrated circuit includes elastically deforming the array of compliant contacts.