Inventor

EATON BRAD

US92 patents

⚠️ This page may combine multiple inventors who share the name “EATON BRAD”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

EATON BRAD

LEI WEI-SHENG

Wafer dicing using femtosecond-based laser and plasma etch

Residue removal from singulated die sidewall

Laser-dominated laser scribing and plasma etch hybrid wafer dicing

Wafer dicing from wafer backside and front side

Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate reactive post mask-opening clean

Wafer edge warp supression for thin wafer supported by tape frame

Laser and plasma etch wafer dicing using water-soluble die attach film

UV-cure pre-treatment of carrier film for wafer dicing using hybrid laser scribing and plasma etch approach

Hybrid wafer dicing approach using a line shaped laser beam profile laser scribing process and plasma etch process

Hybrid wafer dicing approach using a rectangular shaped two-dimensional top hat laser beam profile or a linear shaped one-dimensional top hat laser beam profile laser scribing process and plasma etch process

Vacuum lamination of polymeric dry films for wafer dicing using hybrid laser scribing and plasma etch approach

Singulation of wafers having wafer-level underfill

Maskless hybrid laser scribing and plasma etching wafer dicing process

Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate non-reactive post mask-opening clean

Water soluble mask formation by dry film lamination

Water soluble mask formation by dry film vacuum lamination for laser and plasma dicing

Dicing wafers having solder bumps on wafer backside

Water soluble mask for substrate dicing by laser and plasma etch

Multi-step and asymmetrically shaped laser beam scribing

Method and apparatus for dicing wafers having thick passivation polymer layer

Hybrid wafer dicing approach using a galvo scanner and linear stage hybrid motion laser scribing process and plasma etch process

Water soluble mask for substrate dicing by laser and plasma etch

Dicing tape protection for wafer dicing using laser scribe process

Dicing tape thermal management by wafer frame support ring cooling during plasma dicing

APPLIED MATERIALS INC

Substrate patterning using hybrid laser scribing and plasma etching processing schemes

Wafer coating

Wafer dicing using femtosecond-based laser and plasma etch

Laser, plasma etch, and backside grind process for wafer dicing

Wafer dicing with wide kerf by laser scribing and plasma etching hybrid approach

Laser and plasma etch wafer dicing with partial pre-curing of UV release dicing tape for film frame wafer application

Hybrid wafer dicing approach using a bessel beam shaper laser scribing process and plasma etch process

Method of coating water soluble mask for laser scribing and plasma etch

Laser and plasma etch wafer dicing with a double sided UV-curable adhesive film

Wafer dicing used hybrid multi-step laser scribing process with plasma etch

Wafer dicing using femtosecond-based laser and plasma etch

Wafer dicing using femtosecond-based laser and plasma etch

Mitigation of particle contamination for wafer dicing processes

Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process

Hybrid wafer dicing approach using a rotating beam laser scribing process and plasma etch process

Multi-layer mask including non-photodefinable laser energy absorbing layer for substrate dicing by laser and plasma etch

Method of outgassing a mask material deposited over a workpiece in a process tool

Baking tool for improved wafer coating process

Multi-step and asymmetrically shaped laser beam scribing

HOLDEN JAMES M

Bi-layer wafer-level underfill mask for wafer dicing and approaches for performing wafer dicing

Pre-patterned dry laminate mask for wafer dicing processes

Multi-layer mask for substrate dicing by laser and plasma etch

KUMAR PRABHAT

Wafer dicing using hybrid laser scribing and plasma etch approach with mask application by vacuum lamination

Hybrid dicing process using a blade and laser

PAPANU JAMES S

Method of die singulation using laser ablation and induction of internal defects with a laser

YALAMANCHILI MADHAVA RAO

In-situ deposited mask layer for device singulation by laser scribing and plasma etch