Inventor
TOKUDA KAYA
JP7 patents
Patents
7 patentsUS11267216B2Mar 8, 2022
Polymer film laminated substrate and method for producing flexible electronic device
TOYO BOSEKI2 citations72
US12172409B2Dec 24, 2024
Laminate of inorganic substrate/polymer film layer with attached protective film, laminate stack, laminate storage method, and laminate transport method
TOYO BOSEKI0 citations61
US12115755B2Oct 15, 2024
Laminate of polyimide film and inorganic substrate
TOYO BOSEKI0 citations59
US11833795B2Dec 5, 2023
Multilayer body and method for producing flexible device
TOYO BOSEKI0 citations58
US11655118B2May 23, 2023
Film roll and film bundle
TOYO BOSEKI0 citations58
US12479194B2Nov 25, 2025
Laminate
TOYO BOSEKI0 citations57
US12391813B2Aug 19, 2025
Layered body including inorganic substrate and polyamic acid cured product
TOYO BOSEKI0 citations47