Inventor

CHEN CHIEN-HSUN

US65 patents

⚠️ This page may combine multiple inventors who share the name “CHEN CHIEN-HSUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHEN CHIEN-HSUN

TAIWAN SEMICONDUCTOR MFG CO LTD

Integrated circuit package and method

Semiconductor structure and method of fabricating the same

Package structure, RDL structure comprising redistribution layer having ground plates and signal lines and method of forming the same

Semiconductor package and manufacturing method thereof

Semiconductor device and method of manufacture

Semiconductor device and method of manufacture

Semiconductor package and manufacturing method thereof

Semiconductor device and method of manufacture

Package structure, RDL structure comprising redistribution layer having ground plates and signal lines

Method for manufacturing semiconductor package with connection structures including via groups

Semiconductor device and method of manufacture

Semiconductor devices and methods of manufacturing

Method for manufacturing semiconductor package with connection structures including via groups

Semiconductor devices and methods of manufacturing

Embedded voltage regulator structure and method forming same

Method for manufacturing semiconductor package with connection structures including via groups

Semiconductor package and manufacturing method thereof

Integrated circuit package and method

Package structure, RDL structure comprising redistribution layer having ground plates and signal lines

Integrated circuit package and method

Integrated circuit package and method

Integrated circuit package and method

Integrated circuit package and method

Integrated circuit package and method

Package including metallic bolstering pattern and manufacturing method of the package

Laminated structure with pads and manufacturing method thereof

Dielectric slots underneath conductive vias in interconnect structure of semiconductor package and method of forming the same

Semiconductor package and manufacturing method thereof

Hybrid dielectric scheme in packages

PURDUE RESEARCH FOUNDATION

Enclosed desorption electrospray ionization probes and method of use thereof

Desorption electrospray ionization sampling without damaging an in vivo tissue sample

Enclosed desorption electrospray ionization probes and method of use thereof

Enclosed desorption electrospray ionization probes and method of use thereof

Enclosed desorption electrospray ionization probes and method of use thereof

Enclosed desorption electrospray ionization probes and method of use thereof

Enclosed desorption electrospray ionization probes and method of use thereof

TAIWAN SEMICONDUCTOR MFG

Method and apparatus for monitoring mask process impact on lithography performance

System and method for generating direct-write pattern

ASUSTEK COMP INC

Hinge assembly for electronic device

Hinge component and the electronic device using thereof

RHINE ELECTRONIC CO LTD

Method of controlling speed of brushless motor of ceiling fan and the circuit thereof

Wireless signal transmission device for a DC brushless ceiling fan motor

COOKS ROBERT GRAHAM

Enclosed desorption electrospray ionization probes and method of use thereof

SCIENBIZIP CONSULTING SHENZHEN CO LTD

Via system of printed circuit board and method of making same

UNIV TSINGHUA

Vertical aligned nano-scale diamond structure and process for fabricating the same

UNIV NAT SUN YAT SEN

Stacked LC resonator and band pass filter using the same

LITE ON ELECTRONICS GUANGZHOU

Disc grabbing apparatus with different states for carrying and releasing disc

WISTRON CORP

Antenna system

IXENSOR CO LTD

Apparatus and method of determining biological property with test strip adaptor

FUKUTA ELECTRIC & MACHINERY CO LTD

Motor stator cooling structure