Inventor
CHUNG JAE HAN
KR19 patents
⚠️ This page may combine multiple inventors who share the name “CHUNG JAE HAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HYUNDAI MOTOR CO LTD
9 patentsUS11085584B2Aug 10, 2021
High-pressure composite container having gastight nozzle structure
HYUNDAI MOTOR CO LTD2 citations72
US10047910B2Aug 14, 2018
Apparatus for fastening gas vessel and manufacturing method of the same
HYUNDAI MOTOR CO LTD2 citations72
US11271225B2Mar 8, 2022
Thermal-activated pressure relief device for fuel cell vehicle
HYUNDAI MOTOR CO LTD2 citations70
US10274132B2Apr 30, 2019
Multi-sealed nozzle and pressure vessel including the same
HYUNDAI MOTOR CO LTD2 citations67
US11331691B2May 17, 2022
Apparatus and method of manufacturing tow prepreg
HYUNDAI MOTOR CO LTD2 citations63
US12451500B2Oct 21, 2025
Hydrogen storage system and method for adjusting differential pressure therein
HYUNDAI MOTOR CO LTD0 citations62
US9656543B2May 23, 2017
Fuel gas tank manufacturing method
HYUNDAI MOTOR CO LTD0 citations51
US10767814B2Sep 8, 2020
Pressure vessel equipped with permeated gas discharging structure
HYUNDAI MOTOR CO LTD0 citations47
US9656612B2May 23, 2017
Apparatus for fastening pressure vessel of vehicle and pressure vessel fastening system
HYUNDAI MOTOR CO LTD0 citations41
STATS CHIPPAC LTD
4 patentsUS7445962B2Nov 4, 2008
Stacked integrated circuits package system with dense routability and high thermal conductivity
STATS CHIPPAC LTD21 citations89
US7859099B2Dec 28, 2010
Integrated circuit packaging system having through silicon via with direct interconnects and method of manufacture thereof
STATS CHIPPAC LTD6 citations72
US7875967B2Jan 25, 2011
Integrated circuit with step molded inner stacking module package in package system
STATS CHIPPAC LTD0 citations52
US7687920B2Mar 30, 2010
Integrated circuit package-on-package system with central bond wires
STATS CHIPPAC LTD1 citations51