Inventor
HAMASAKI HIROSHI
JP49 patents
⚠️ This page may combine multiple inventors who share the name “HAMASAKI HIROSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOSHIBA KK
42 patentsUS7489514B2Feb 10, 2009
LSI package equipped with interface module, interface module and connection holding mechanism
TOSHIBA KK53 citations98
US7394665B2Jul 1, 2008
LSI package provided with interface module and method of mounting the same
TOSHIBA KK60 citations98
US5412748AMay 2, 1995
Optical semiconductor module
TOSHIBA KK158 citations97
US5559918ASep 24, 1996
Optical semiconductor module in which a hermetically sealed optical semiconductor device is connected to an electrical wiring layer
TOSHIBA KK55 citations95
US5434426AJul 18, 1995
Optical interconnection device
TOSHIBA KK70 citations95
US5205032AApr 27, 1993
Electronic parts mounting apparatus
TOSHIBA KK92 citations94
US7352935B2Apr 1, 2008
Optoelectronic conversion header, LSI package with interface module, method of manufacturing optoelectronic conversion header, and optical interconnection system
TOSHIBA KK28 citations93
US7314317B2Jan 1, 2008
Optical fiber connector and connecting method
TOSHIBA KK19 citations93
US7198412B2Apr 3, 2007
Holder of optical transmission lines and multi-core optical wave-guide
TOSHIBA KK22 citations93
US7154751B2Dec 26, 2006
Interface module-mounted LSI package
TOSHIBA KK16 citations93
US6449296B1Sep 10, 2002
Semiconductor laser device
TOSHIBA KK37 citations93
US7118294B2Oct 10, 2006
Optical semiconductor module and its manufacturing method
TOSHIBA KK23 citations92
USRE41742ESep 21, 2010
Optoelectronic conversion header, LSI package with interface module, method of manufacturing optoelectronic conversion header, and optical interconnection system
TOSHIBA KK13 citations84
US7667311B2Feb 23, 2010
LSI package provided with interface module, and transmission line header employed in the package
TOSHIBA KK10 citations84
US7667982B2Feb 23, 2010
LSI package with interface module and interface module
TOSHIBA KK18 citations84
US7441964B2Oct 28, 2008
Optical guide holding member and optical module
TOSHIBA KK9 citations84
US7411282B2Aug 12, 2008
LSI package provided with interface module, and transmission line header employed in the package
TOSHIBA KK10 citations84
US7312520B2Dec 25, 2007
Interface module for connecting LSI packages, and LSI-incorporating apparatus
TOSHIBA KK10 citations84
US6687272B2Feb 3, 2004
Semiconductor laser device
TOSHIBA KK12 citations74
US6654393B2Nov 25, 2003
Semiconductor laser device
TOSHIBA KK7 citations74
US11921021B2Mar 5, 2024
Gas concentration device, gas detection system, gas concentration method, and gas detection method
TOSHIBA KK2 citations73
US8852976B2Oct 7, 2014
Method for manufacturing semiconductor light emitting device
TOSHIBA KK3 citations63
US7775727B2Aug 17, 2010
Optical module and manufacturing method of the same
TOSHIBA KK5 citations63
US7759781B2Jul 20, 2010
LSI package provided with interface module
TOSHIBA KK3 citations63
US7711237B2May 4, 2010
Optical transmission line holding member, optical module and mounting method thereof
TOSHIBA KK4 citations63
US7438481B2Oct 21, 2008
Optical semiconductor module and semiconductor device including the same
TOSHIBA KK4 citations63
US7330352B2Feb 12, 2008
Interface module-mounted LSI package
TOSHIBA KK3 citations63
US7300213B2Nov 27, 2007
Member holding optical transmission line and optical module
TOSHIBA KK4 citations63
US7255493B2Aug 14, 2007
Optical semiconductor module and its manufacturing method
TOSHIBA KK3 citations63
US7192199B2Mar 20, 2007
Optical semiconductor module and method of manufacturing the same
TOSHIBA KK5 citations63
US12480923B2Nov 25, 2025
Chemical sensor system
TOSHIBA KK0 citations52
US10337976B2Jul 2, 2019
Microanalysis chip
TOSHIBA KK0 citations52
US9306141B2Apr 5, 2016
Method for manufacturing semiconductor light emitting device
TOSHIBA KK0 citations52
US9105828B2Aug 11, 2015
Method for manufacturing semiconductor light emitting device
TOSHIBA KK0 citations52
US7554806B2Jun 30, 2009
Interface module-mounted LSI package
TOSHIBA KK0 citations52
US10281429B2May 7, 2019
Semiconductor micro-analysis chip and method of manufacturing the same
TOSHIBA KK0 citations42
US10113947B2Oct 30, 2018
Semiconductor analysis chip and particle inspection method
TOSHIBA KK0 citations42
US7187048B2Mar 6, 2007
Semiconductor light-receiving device
TOSHIBA KK0 citations42
US10533934B2Jan 14, 2020
Particle inspection system and driving method employed therein
TOSHIBA KK0 citations41
US9895691B2Feb 20, 2018
Analysis package for detecting particles in a sample liquid
TOSHIBA KK0 citations41
US9885680B2Feb 6, 2018
Analysis package for detecting particles in a sample liquid including an analysis chip mounted on a package board
TOSHIBA KK0 citations41
US9770714B2Sep 26, 2017
Analysis package for detecting particles in a sample liquid, and including shield layers
TOSHIBA KK0 citations41
SUMITOMO ELECTRIC INDUSTRIES
3 patentsUS7771130B2Aug 10, 2010
Method of producing optical fiber positioning component, and optical fiber positioning component
SUMITOMO ELECTRIC INDUSTRIES2 citations63
US7401983B2Jul 22, 2008
Method for manufacturing optical coupling part and optical coupling part
SUMITOMO ELECTRIC INDUSTRIES3 citations63
US7364369B2Apr 29, 2008
Lead frame, optical coupling part using lead frame, and manufacturing method of optical coupling part
SUMITOMO ELECTRIC INDUSTRIES5 citations63