Optoelectronic conversion header, LSI package with interface module, method of manufacturing optoelectronic conversion header, and optical interconnection system

Abstract

In an optoelectronic conversion header, a ferrule holds an optical waveguide in a predetermined position so that an end face of the optical waveguide protrudes from an mounting surface of the ferrule. An electric wire is provided on the mounting surface of the ferrule, a optical semiconductor device is mounted on the mounting surface of the ferrule and electrically connected to the electric wire. From the end face of the optical waveguide, an optical signal is transferred in a transfer direction and the mounting surface of the ferrule is so arranged as to be deviated two degrees or more from a plane vertical to the transfer direction.

1. An optoelectronic conversion header comprising:
 an optical waveguide which guides an optical signal and has an end face;  
 a ferrule, having a mounting surface, which holds the optical waveguide in a predetermined position so that the end face of the optical waveguide protrudes from the mounting surface;  
 an electric wire provided on the mounting surface of the ferrule; and  
 an optoelectronic converter having an optical input/output surface, which is electrically connected to the electric wire and is mounted on the mounting surface of the ferrule, the optical input/output surface being faced to the end face of the optical waveguide so as to transfer the optical signal along a transfer direction between the optical input/output surface and the end face of the optical waveguide, the end face being substantially vertical to the transfer direction, and the optical input/output surface and the mounting surface being deviated two degrees or more from a plane vertical to the transfer direction.  
 
     
     
       2. The optoelectronic conversion header according to  claim 1 , wherein the ferrule has a side surface crossing the mounting surface, and the electric wire is formed to extend from the mounting surface to the side surface. 
     
     
       3. The optoelectronic conversion header according to  claim 1 , wherein a transparent resin is provided between the optical input/output surface and the end face of the optical waveguide. 
     
     
       4. The optoelectronic conversion header according to  claim 1 , wherein the mounting surface is substantially parallel to the optical input/output surface. 
     
     
       5. An optoelectronic conversion header comprising:
   an optical waveguide which guides an optical signal and has an end face;        a ferrule, having a mounting surface, which holds the optical waveguide in a predetermined position;        an electric wire provided on the mounting surface of the ferrule; and        an optoelectronic converter having an optical input/output surface, which is electrically connected to the electric wire and is mounted on the mounting surface of the ferrule, the optical input/output surface being faced to the end face of the optical waveguide so as to transfer the optical signal along a transfer direction between the optical input/output surface and the end face of the optical waveguide, the end face being substantially vertical to the transfer direction, and the optical input/output surface and the mounting surface being deviated two degrees or more from a plane vertical to the transfer direction.     
     
     
       6. The optoelectronic conversion header according to  claim 5 , wherein the ferrule has a side surface crossing the mounting surface, and the electric wire is formed to extend from the mounting surface to the side surface. 
     
     
       7. The optoelectronic conversion header according to  claim 5 , wherein a transparent resin is provided between the optical input/output surface and the end face of the optical waveguide. 
     
     
       8. The optoelectronic conversion header according to  claim 5 , wherein the mounting surface is substantially parallel to the optical input/output surface. 
     
     
       9. The optoelectronic conversion header according to  claim 8 , wherein the optoelectronic converter is electrically connected to the electric wire via a plurality of metal bumps. 
     
     
       10. The optoelectronic conversion header according to  claim 9 , wherein the plurality of metal bumps has substantially same thickness. 
     
     
       11. The optoelectronic conversion header according to  claim 10 , wherein the optoelectronic converter includes an electrode connected to an active region of the optoelectronic converter via the metal bump, the distance between the optoelectronic converter and the optical waveguide varies from a minimum distance, and the electrode is provided in a region other than a region where a distance between the optoelectronic converter and the optical waveguide is the minimum. 
     
     
       12. The optoelectronic conversion header according to  claim 9 , wherein the optoelectronic converter includes an electrode connected to an active region of the optoelectronic converter via the metal bump, the distance between the optoelectronic converter and the optical waveguide varies from a minimum distance, and the electrode is provided in a region other than a region where a distance between the optoelectronic converter and the optical waveguide is the minimum. 
     
     
       13. The optoelectronic conversion header according to  claim 8 , wherein the optoelectronic converter includes an electrode connected to an active region of the optoelectronic converter, the distance between the optoelectronic converter and the optical waveguide varies from a minimum distance, and the electrode is provided in a region other than a region where a distance between the optoelectronic converter and the optical waveguide is the minimum. 
     
     
       14. The optoelectronic conversion header according to  claim 5 , wherein the optoelectronic converter is electrically connected to the electric wire via a plurality of metal bumps. 
     
     
       15. The optoelectronic conversion header according to  claim 14 , wherein the plurality of metal bumps has substantially same thickness. 
     
     
       16. The optoelectronic conversion header according to  claim 15 , wherein the optoelectronic converter includes an electrode connected to an active region of the optoelectronic converter via the metal bump, the distance between the optoelectronic converter and the optical waveguide varies from a minimum distance, and the electrode is provided in a region other than a region where a distance between the optoelectronic converter and the optical waveguide is the minimum. 
     
     
       17. The optoelectronic conversion header according to  claim 14 , wherein the optoelectronic converter includes an electrode connected to an active region of the optoelectronic converter via the metal bump, the distance between the optoelectronic converter and the optical waveguide varies from a minimum distance, and the electrode is provided in a region other than a region where a distance between the optoelectronic converter and the optical waveguide is the minimum. 
     
     
       18. The optoelectronic conversion header according to  claim 5 , wherein the optoelectronic converter includes an electrode connected to an active region of the optoelectronic converter, the distance between the optoelectronic converter and the optical waveguide varies from a minimum distance, and the electrode is provided in a region other than a region where a distance between the optoelectronic converter and the optical waveguide is the minimum.