Inventor · disambiguated record
Hiroshi Hamasaki
Also filed as: HAMASAKI HIROSHI
49 granted patents·12 pending applications·845 citations·filing 1991–2025
98Inventor score
Files withTOSHIBA KK49HAMASAKI HIROSHI3SUMITOMO ELECTRIC INDUSTRIES3AIPORE INC1CORP TOSHIBA LIGHTING & TECHNOLOGY1
Top patents by PatentIndex Score
61 records- 0196US7489514B2LSI package equipped with interface module, interface module and connection holding mechanismTOSHIBA KK·Filed 2005·Granted Feb 10, 2009·53 cites·13 claims
- 0295US11921021B2Gas concentration device, gas detection system, gas concentration method, and gas detection methodTOSHIBA KK·Filed 2021·Granted Mar 5, 2024·2 cites·22 claims
- 0395US8148183B2Method for manufacturing semiconductor light emitting deviceHAMASAKI HIROSHI·Filed 2010·Granted Apr 3, 2012·13 cites·21 claims
- 0495US5412748AOptical semiconductor moduleTOSHIBA KK·Filed 1993·Granted May 2, 1995·158 cites·6 claims
- 0593US7352935B2Optoelectronic conversion header, LSI package with interface module, method of manufacturing optoelectronic conversion header, and optical interconnection systemTOSHIBA KK·Filed 2005·Granted Apr 1, 2008·28 cites·4 claims
- 0691US7535090B2LSI package provided with interface moduleKABUHSIKI KAISHA TOSHIBA·Filed 2004·Granted May 19, 2009·59 cites·20 claims
- 0791US6449296B1Semiconductor laser deviceTOSHIBA KK·Filed 2000·Granted Sep 10, 2002·37 cites·25 claims
- 0890US8610163B2Method for manufacturing semiconductor light emitting deviceHAMASAKI HIROSHI·Filed 2012·Granted Dec 17, 2013·5 cites·22 claims
- 0990US7411282B2LSI package provided with interface module, and transmission line header employed in the packageTOSHIBA KK·Filed 2005·Granted Aug 12, 2008·10 cites·20 claims
- 1090US7394665B2LSI package provided with interface module and method of mounting the sameTOSHIBA KK·Filed 2004·Granted Jul 1, 2008·60 cites·19 claims
- 1189US7667982B2LSI package with interface module and interface moduleTOSHIBA KK·Filed 2008·Granted Feb 23, 2010·18 cites·19 claims
- 1289US7314317B2Optical fiber connector and connecting methodTOSHIBA KK·Filed 2005·Granted Jan 1, 2008·19 cites·20 claims
- 1389US5434426AOptical interconnection deviceTOSHIBA KK·Filed 1993·Granted Jul 18, 1995·70 cites·20 claims
- 1487US8852976B2Method for manufacturing semiconductor light emitting deviceTOSHIBA KK·Filed 2013·Granted Oct 7, 2014·3 cites·21 claims
- 1587USRE41742EOptoelectronic conversion header, LSI package with interface module, method of manufacturing optoelectronic conversion header, and optical interconnection systemTOSHIBA KK·Filed 2009·Granted Sep 21, 2010·13 cites·18 claims
- 1684US7667311B2LSI package provided with interface module, and transmission line header employed in the packageTOSHIBA KK·Filed 2008·Granted Feb 23, 2010·10 cites·22 claims
- 1784US5205032AElectronic parts mounting apparatusTOSHIBA KK·Filed 1991·Granted Apr 27, 1993·92 cites·18 claims
- 1883US7118294B2Optical semiconductor module and its manufacturing methodTOSHIBA KK·Filed 2004·Granted Oct 10, 2006·23 cites·4 claims
- 1982US5559918AOptical semiconductor module in which a hermetically sealed optical semiconductor device is connected to an electrical wiring layerTOSHIBA KK·Filed 1995·Granted Sep 24, 1996·55 cites·16 claims
- 2081US7312520B2Interface module for connecting LSI packages, and LSI-incorporating apparatusTOSHIBA KK·Filed 2005·Granted Dec 25, 2007·10 cites·22 claims
- 2181US7198412B2Holder of optical transmission lines and multi-core optical wave-guideTOSHIBA KK·Filed 2004·Granted Apr 3, 2007·22 cites·20 claims
- 2280US7441964B2Optical guide holding member and optical moduleTOSHIBA KK·Filed 2006·Granted Oct 28, 2008·9 cites·17 claims
- 2375US7154751B2Interface module-mounted LSI packageTOSHIBA KK·Filed 2004·Granted Dec 26, 2006·16 cites·12 claims
- 2475US6687272B2Semiconductor laser deviceTOSHIBA KK·Filed 2002·Granted Feb 3, 2004·12 cites·21 claims
- 2573US7364369B2Lead frame, optical coupling part using lead frame, and manufacturing method of optical coupling partSUMITOMO ELECTRIC INDUSTRIES·Filed 2007·Granted Apr 29, 2008·5 cites·6 claims
- 2671US7438481B2Optical semiconductor module and semiconductor device including the sameTOSHIBA KK·Filed 2005·Granted Oct 21, 2008·4 cites·20 claims
- 2770US12480923B2Chemical sensor systemTOSHIBA KK·Filed 2023·Granted Nov 25, 2025·0 cites·17 claims
- 2870US7775727B2Optical module and manufacturing method of the sameTOSHIBA KK·Filed 2008·Granted Aug 17, 2010·5 cites·20 claims
- 2970US7330352B2Interface module-mounted LSI packageTOSHIBA KK·Filed 2006·Granted Feb 12, 2008·3 cites·10 claims
- 3069US7711237B2Optical transmission line holding member, optical module and mounting method thereofTOSHIBA KK·Filed 2008·Granted May 4, 2010·4 cites·19 claims
- 3169US2025290958A1SensorTOSHIBA KK·Filed 2025·Application pending·0 cites
- 3268US7759781B2LSI package provided with interface moduleTOSHIBA KK·Filed 2006·Granted Jul 20, 2010·3 cites·3 claims
- 3368US7300213B2Member holding optical transmission line and optical moduleTOSHIBA KK·Filed 2006·Granted Nov 27, 2007·4 cites·15 claims
- 3467US9105828B2Method for manufacturing semiconductor light emitting deviceTOSHIBA KK·Filed 2014·Granted Aug 11, 2015·0 cites·12 claims
- 3566US7255493B2Optical semiconductor module and its manufacturing methodTOSHIBA KK·Filed 2006·Granted Aug 14, 2007·3 cites·18 claims
- 3666US2021096099A1Analysis chipAIPORE INC·Filed 2020·Application pending·0 cites
- 3765US6654393B2Semiconductor laser deviceTOSHIBA KK·Filed 2002·Granted Nov 25, 2003·7 cites·26 claims
- 3864US9306141B2Method for manufacturing semiconductor light emitting deviceTOSHIBA KK·Filed 2015·Granted Apr 5, 2016·0 cites·18 claims
- 3964US7401983B2Method for manufacturing optical coupling part and optical coupling partSUMITOMO ELECTRIC INDUSTRIES·Filed 2006·Granted Jul 22, 2008·3 cites·10 claims
- 4061US7771130B2Method of producing optical fiber positioning component, and optical fiber positioning componentSUMITOMO ELECTRIC INDUSTRIES·Filed 2007·Granted Aug 10, 2010·2 cites·9 claims
- 4160US2025290882A1Thermal conductivity gas sensor system and sensing methodTOSHIBA KK·Filed 2025·Application pending·0 cites
- 4258US7192199B2Optical semiconductor module and method of manufacturing the sameTOSHIBA KK·Filed 2004·Granted Mar 20, 2007·5 cites·12 claims
- 4358US2025290805A1SensorTOSHIBA KK·Filed 2025·Application pending·0 cites
- 4457US2018088081A1Analysis chipTOSHIBA KK·Filed 2017·Application pending·0 cites
- 4557US2022276200A1Chemical sensor module and method for detecting hydrophobic target moleculesTOSHIBA KK·Filed 2021·Application pending·0 cites
- 4655US2024077451A1Gas sensor systemTOSHIBA KK·Filed 2023·Application pending·0 cites
- 4753US7554806B2Interface module-mounted LSI packageTOSHIBA KK·Filed 2007·Granted Jun 30, 2009·0 cites·19 claims
- 4848US10337976B2Microanalysis chipTOSHIBA KK·Filed 2015·Granted Jul 2, 2019·0 cites·6 claims
- 4948US10281429B2Semiconductor micro-analysis chip and method of manufacturing the sameTOSHIBA KK·Filed 2017·Granted May 7, 2019·0 cites·15 claims
- 5046US10533934B2Particle inspection system and driving method employed thereinTOSHIBA KK·Filed 2017·Granted Jan 14, 2020·0 cites·18 claims
Showing the top 50 of 61 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →