Inventor
PU BRYAN
US19 patents
⚠️ This page may combine multiple inventors who share the name “PU BRYAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
12 patentsUS5843847ADec 1, 1998
Method for etching dielectric layers with high selectivity and low microloading
APPLIED MATERIALS INC319 citations99
US5674321AOct 7, 1997
Method and apparatus for producing plasma uniformity in a magnetic field-enhanced plasma reactor
APPLIED MATERIALS INC150 citations99
US7316761B2Jan 8, 2008
Apparatus for uniformly etching a dielectric layer
APPLIED MATERIALS INC178 citations97
US6916399B1Jul 12, 2005
Temperature controlled window with a fluid supply system
APPLIED MATERIALS INC168 citations96
US6113731ASep 5, 2000
Magnetically-enhanced plasma chamber with non-uniform magnetic field
APPLIED MATERIALS INC152 citations96
US6364957B1Apr 2, 2002
Support assembly with thermal expansion compensation
APPLIED MATERIALS INC368 citations95
US5891350AApr 6, 1999
Adjusting DC bias voltage in plasma chambers
APPLIED MATERIALS INC186 citations95
US5740009AApr 14, 1998
Apparatus for improving wafer and chuck edge protection
APPLIED MATERIALS INC117 citations95
US7540971B2Jun 2, 2009
Plasma etch process using polymerizing etch gases across a wafer surface and additional polymer managing or controlling gases in independently fed gas zones with time and spatial modulation of gas content
APPLIED MATERIALS INC16 citations84
US7541292B2Jun 2, 2009
Plasma etch process with separately fed carbon-lean and carbon-rich polymerizing etch gases in independent inner and outer gas injection zones
APPLIED MATERIALS INC12 citations84
US7431859B2Oct 7, 2008
Plasma etch process using polymerizing etch gases with different etch and polymer-deposition rates in different radial gas injection zones with time modulation
APPLIED MATERIALS INC18 citations84
US7432210B2Oct 7, 2008
Process to open carbon based hardmask
APPLIED MATERIALS INC9 citations82