Inventor

ELSHERBINI ADEL A

US206 patents

⚠️ This page may combine multiple inventors who share the name “ELSHERBINI ADEL A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ELSHERBINI ADEL A

INTEL CORP

Single-package phased array module with interleaved sub-arrays

Patch system for in-situ therapeutic treatment

Microelectronic assemblies with communication networks

Quantum computing assemblies with through-hole dies

Quantum computing assemblies

Multi-layer package with integrated antenna

Shielded interconnects

Direct bonding in microelectronic assemblies

Serializer-deserializer die for high speed signal interconnect

Quantum computing assemblies

Microelectronic assemblies having an integrated voltage regulator chiplet

Microelectronic assemblies

Microelectronic assemblies

Multi-chip package with high density interconnects

Microelectronic assemblies

Microelectronic assemblies with communication networks

Quantum circuit assemblies with on-chip demultiplexers

Microelectronic package electrostatic discharge (ESD) protection

Quantum circuit assemblies with Josephson junctions utilizing resistive switching materials

Semiconductor packages with antennas

Package substrates with top superconductor layers for qubit devices

Microelectronic package communication using radio interfaces connected through waveguides

Patch system for in-situ therapeutic treatment

Electrical connectors for high density attach to stretchable boards

Sacrificial redistribution layer in microelectronic assemblies having direct bonding

Packaged device including a transmission line associated with one of a conductive shield, vertical stubs, and vertically interdigitated stubs

Low loss and low cross talk transmission lines using shaped vias

Method of making an electromagnetic interference shield for semiconductor chip packages

Direct bonding in microelectronic assemblies

Microelectronic assemblies with inductors in direct bonding regions

Direct bonding in microelectronic assemblies

Hermetic sealing structures in microelectronic assemblies having direct bonding

Microelectronic assemblies with communication networks

Microelectronic assemblies with inductors in direct bonding regions

Microelectronic assemblies

Microelectronic assemblies

Microelectronic assemblies with communication networks

Microelectronic assemblies with communication networks

Microelectronic assemblies

Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device

Microelectronic assemblies

Microelectronic assemblies

Superconducting qubit device packages

Semiconductor packages with antennas

Microelectronic assemblies

Microelectronic assemblies having magnetic core inductors

Microelectronic assemblies with communication networks

Diodes for package substrate electrostatic discharge (ESD) protection

Microelectronic assemblies

ELSHERBINI ADEL A

Magnetic core inductor (MCI) structures for integrated voltage regulators