Inventor

SAXENA KULDEEP

US9 patents

⚠️ This page may combine multiple inventors who share the name “SAXENA KULDEEP”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WOLFSPEED INC

4 patents

USD969762SNov 15, 2022

Power semiconductor package

WOLFSPEED INC15 citations91

USD1121577SApr 7, 2026

Power package

WOLFSPEED INC0 citations60

US12224233B2Feb 11, 2025

Packaged electronic devices having dielectric substrates with thermally conductive adhesive layers

WOLFSPEED INC0 citations59

US12199045B2Jan 14, 2025

Power semiconductor package with improved performance

WOLFSPEED INC0 citations56

AKUSTICA INC

2 patents

US10442683B2Oct 15, 2019

Corrugated package for microelectromechanical system (MEMS) device

AKUSTICA INC5 citations70

US9781519B2Oct 3, 2017

Molded interconnect mircoelectromechanical system (MEMS) device package

AKUSTICA INC2 citations70

BOSCH GMBH ROBERT

2 patents

US9661421B2May 23, 2017

Microphone package with molded spacer

BOSCH GMBH ROBERT2 citations70

US9894444B2Feb 13, 2018

Microphone package with molded spacer

BOSCH GMBH ROBERT0 citations49

CREE INC

1 patent

USD937231SNov 30, 2021

Power semiconductor package

CREE INC14 citations91