Inventor

LANDMAN EVELYN

IL31 patents

⚠️ This page may combine multiple inventors who share the name “LANDMAN EVELYN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LANDMAN EVELYN

PROTEANTECS LTD

Die-to-die and chip-to-chip connectivity monitoring

Integrated circuit margin measurement and failure prediction device

Die-to-die connectivity monitoring

Die-to-die connectivity monitoring using a clocked receiver

Integrated circuit pad failure detection

Integrated circuit margin measurement and failure prediction device

Integrated circuit margin measurement for structural testing

Integrated circuit profiling and anomaly detection

Integrated circuit workload, temperature and/or subthreshold leakage sensor

Integrated circuit I/O integrity and degradation monitoring

Efficient integrated circuit simulation and testing

Loopback testing of integrated circuits

Memory device degradation monitoring

Integrated circuit I/O integrity and degradation monitoring

Integrated circuit I/O integrity and degradation monitoring

Integrated circuit margin measurement and failure prediction device

Integrated circuit profiling and anomaly detection

Efficient integrated circuit simulation and testing

Integrated circuit workload, temperature, and/or sub-threshold leakage sensor

Thermal sensor for integrated circuit

Integrated circuit degradation estimation and time-of-failure prediction using workload and margin sensing

Die-to-die connectivity monitoring

Adaptive frequency scaling based on clock cycle time measurement

Integrated circuit margin measurement

Integrated circuit pad failure detection

MELLANOX TECHNOLOGIES LTD

High-reliability active optical cable (AOC) with redundant emitters

Wavelength auto-negotiation

Opto-mechanical coupler

Printed circuit board assembly with a photonic integrated circuit for an electro-optical interface

Redundant and reconfigurable optical transceiver

Transducer reliability testing