Inventor · disambiguated record
Laurence D. Schultz
Also filed as: SCHULTZ LAURENCE D · SCHULTZ LAURENCE DARNELL
16 granted patents·2 pending applications·2,759 citations·filing 1990–2006
96Inventor score
Files withMICRON TECHNOLOGY INC9LUCENT TECHNOLOGIES INC3AGERE SYSTEMS INC2TEXAS INSTRUMENTS INC2MICROELECTRONICS & COMPUTER1
Top patents by PatentIndex Score
18 records- 0199US5421769AApparatus for planarizing semiconductor wafers, and a polishing pad for a planarization apparatusMICRON TECHNOLOGY INC·Filed 1993·Granted Jun 6, 1995·238 cites·30 claims
- 0299US5234867AMethod for planarizing semiconductor wafers with a non-circular polishing padMICRON TECHNOLOGY INC·Filed 1992·Granted Aug 10, 1993·253 cites·4 claims
- 0398US5871392AUnder-pad for chemical-mechanical planarization of semiconductor wafersMICRON TECHNOLOGY INC·Filed 1996·Granted Feb 16, 1999·204 cites·27 claims
- 0498US5081796AMethod and apparatus for mechanical planarization and endpoint detection of a semiconductor waferMICRON TECHNOLOGY INC·Filed 1990·Granted Jan 21, 1992·490 cites·22 claims
- 0597US5514245AMethod for chemical planarization (CMP) of a semiconductor wafer to provide a planar surface free of microscratchesMICRON TECHNOLOGY INC·Filed 1995·Granted May 7, 1996·276 cites·17 claims
- 0697US5036015AMethod of endpoint detection during chemical/mechanical planarization of semiconductor wafersMICRON TECHNOLOGY INC·Filed 1990·Granted Jul 30, 1991·389 cites·11 claims
- 0796USRE34425EMethod and apparatus for mechanical planarization and endpoint detection of a semiconductor waferMICRON TECHNOLOGY INC·Filed 1992·Granted Nov 2, 1993·138 cites·23 claims
- 0896US5069002AApparatus for endpoint detection during mechanical planarization of semiconductor wafersMICRON TECHNOLOGY INC·Filed 1991·Granted Dec 3, 1991·311 cites·9 claims
- 0995US5980363AUnder-pad for chemical-mechanical planarization of semiconductor wafersMICRON TECHNOLOGY INC·Filed 1999·Granted Nov 9, 1999·126 cites·17 claims
- 1090US6048256AApparatus and method for continuous delivery and conditioning of a polishing slurryLUCENT TECHNOLOGIES INC·Filed 1999·Granted Apr 11, 2000·110 cites·23 claims
- 1189US5011580AMethod of reworking an electrical multilayer interconnectMICROELECTRONICS & COMPUTER·Filed 1990·Granted Apr 30, 1991·120 cites·24 claims
- 1278US6896583B2Method and apparatus for conditioning a polishing padAGERE SYSTEMS INC·Filed 2001·Granted May 24, 2005·24 cites·11 claims
- 1377US6083838AMethod of planarizing a surface on a semiconductor waferLUCENT TECHNOLOGIES INC·Filed 1998·Granted Jul 4, 2000·52 cites·18 claims
- 1459US6056630APolishing apparatus with carrier head pivoting deviceLUCENT TECHNOLOGIES INC·Filed 1998·Granted May 2, 2000·20 cites·28 claims
- 1554US6702654B2Conditioning wheel for conditioning a semiconductor wafer polishing pad and method of manufacture thereofAGERE SYSTEMS INC·Filed 2001·Granted Mar 9, 2004·5 cites·13 claims
- 1649US7695589B2Versatile system for conditioning slurry in CMP processTEXAS INSTRUMENTS INC·Filed 2004·Granted Apr 13, 2010·3 cites·9 claims
- 1747US2006276042A1Versatile system for conditioning slurry in cmp processTEXAS INSTRUMENTS INC·Filed 2006·Application pending·0 cites
- 1834US2002106829A1Conditioning wheel for conditioning a semiconductor wafer polishing pad and method of manufacture thereofFiled 2001·Application pending·0 cites
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