Inventor
GAN THAI KEE
MY10 patents
⚠️ This page may combine multiple inventors who share the name “GAN THAI KEE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INFINEON TECHNOLOGIES AG
9 patentsUS11652078B2May 16, 2023
High voltage semiconductor package with pin fit leads
INFINEON TECHNOLOGIES AG3 citations67
US12068213B2Aug 20, 2024
Chip package and semiconductor arrangement having thermally conductive material in contact with a semiconductor chip and methods of forming thereof
INFINEON TECHNOLOGIES AG0 citations60
US11984392B2May 14, 2024
Semiconductor package having a chip carrier with a pad offset feature
INFINEON TECHNOLOGIES AG0 citations60
US11069600B2Jul 20, 2021
Semiconductor package with space efficient lead and die pad design
INFINEON TECHNOLOGIES AG1 citations59
US11417538B2Aug 16, 2022
Semiconductor package including leads of different lengths
INFINEON TECHNOLOGIES AG0 citations58
US11011456B2May 18, 2021
Lead frames including lead posts in different planes
INFINEON TECHNOLOGIES AG0 citations57
US12205874B2Jan 21, 2025
Semiconductor package with wire bond joints
INFINEON TECHNOLOGIES AG0 citations54
US11842953B2Dec 12, 2023
Semiconductor package with wire bond joints and related methods of manufacturing
INFINEON TECHNOLOGIES AG0 citations54
US12057376B2Aug 6, 2024
Three level interconnect clip
INFINEON TECHNOLOGIES AG0 citations48