Inventor · disambiguated record
Im-Soo Park
Also filed as: PARK IM-SOO
14 granted patents·6 pending applications·340 citations·filing 2001–2021
92Inventor score
Top patents by PatentIndex Score
20 records- 0196US7488688B2Method of removing oxide layer and semiconductor manufacturing apparatus for removing oxide layerSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Feb 10, 2009·250 cites·19 claims
- 0292US10418366B2Semiconductor devices including enlarged contact hole and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 17, 2019·7 cites·14 claims
- 0389US10916549B2Semiconductor devices including enlarged contact hole and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 9, 2021·4 cites·20 claims
- 0488US8766343B2Integrated circuit capacitors having sidewall supportsKANG DAE-HYUK·Filed 2012·Granted Jul 1, 2014·10 cites·20 claims
- 0588US8119476B2Methods of forming integrated circuit capacitors having sidewall supports and capacitors formed therebyKANG DAE-HYUK·Filed 2010·Granted Feb 21, 2012·10 cites·16 claims
- 0687US6565736B2Wet process for semiconductor device fabrication using anode water containing oxidative substances and cathode water containing reductive substances, and anode water and cathode water used in the wet processSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted May 20, 2003·42 cites·23 claims
- 0773US7354868B2Methods of fabricating a semiconductor device using a dilute aqueous solution of an ammonia and peroxide mixtureSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Apr 8, 2008·4 cites·16 claims
- 0872US7820508B2Semiconductor device having capacitor and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Oct 26, 2010·3 cites·17 claims
- 0971US7985999B2Semiconductor device having capacitorSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted Jul 26, 2011·2 cites·8 claims
- 1068US11329053B2Semiconductor devices including enlarged contact hole and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 10, 2022·0 cites·20 claims
- 1158US7237561B2Apparatus for cleaning semiconductor wafer including heating using a light source and method for cleaning wafer using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jul 3, 2007·5 cites·10 claims
- 1252US6712078B2Apparatus for cleaning semiconductor wafer and method for cleaning wafer using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Mar 30, 2004·3 cites·7 claims
- 1350US8058180B2Methods of fabricating a semiconductor device using a dilute aqueous solution of an ammonia and peroxide mixtureKWON DOO-WON·Filed 2008·Granted Nov 15, 2011·0 cites·15 claims
- 1443US7135413B2Cleaning solution for removing damaged portion of ferroelectric layer and cleaning method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Nov 14, 2006·0 cites·24 claims
- 1542US2006228890A1Cleaning solution and method of forming a metal pattern for a semiconductor device using the sameLEE HYO-SAN·Filed 2006·Application pending·0 cites
- 1642US2008044971A1Method for fabricating a semiconductor device having a capacitorSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 1739US2002003123A1Cleaning solution for removing damaged portion of ferroelectric layer and cleaning method using the sameFiled 2001·Application pending·0 cites
- 1837US2012064680A1Methods of forming a capacitor structure and methods of manufacturing semiconductor devices using the sameOH JUNG-MIN·Filed 2011·Application pending·0 cites
- 1936US2003062068A1Method of and system for cleaning a semiconductor wafer simultaneously using electrolytically ionized water and diluted hydrofluoric acidFiled 2002·Application pending·0 cites
- 2035US2011306197A1Methods of Manufacturing Semiconductor DevicesKIM YOUNG-HOO·Filed 2011·Application pending·0 cites
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