Inventor
LIU WEI-CHENG
TW27 patents
⚠️ This page may combine multiple inventors who share the name “LIU WEI-CHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HTC CORP
13 patentsUS10785893B1Sep 22, 2020
Heat dissipation module and electronic device
HTC CORP6 citations72
US10667428B1May 26, 2020
Heat dissipation module manufacturing method, heat dissipation module and electronic device
HTC CORP2 citations72
US11194164B2Dec 7, 2021
Head-mounted display device
HTC CORP1 citations62
US12032165B2Jul 9, 2024
Glasses type display device
HTC CORP0 citations60
US11349188B2May 31, 2022
Electronic device
HTC CORP0 citations60
US12386136B2Aug 12, 2025
Head-mounted display device
HTC CORP0 citations59
US12196975B2Jan 14, 2025
Head-mounted display device
HTC CORP0 citations59
US12181918B2Dec 31, 2024
Head mounted display device
HTC CORP0 citations59
US9223429B2Dec 29, 2015
Touch module and electronic apparatus
HTC CORP3 citations56
US12531324B2Jan 20, 2026
Antenna base and antenna set
HTC CORP0 citations55
US12124041B2Oct 22, 2024
Head mounted display device to provide adjustable clamping force
HTC CORP0 citations51
US9374515B2Jun 21, 2016
Electronic element supporting base and electronic device
HTC CORP0 citations49
US12218372B2Feb 4, 2025
Neck-mounted power bank
HTC CORP0 citations44
IND TECH RES INST
4 patentsUS10282915B1May 7, 2019
Superimposition device of virtual guiding indication and reality image and the superimposition method thereof
IND TECH RES INST43 citations91
US9319667B2Apr 19, 2016
Image conversion method and device using calibration reference pattern
IND TECH RES INST15 citations79
US7423970B2Sep 9, 2008
Cross-layer rate adaptation mechanism for WLAN
IND TECH RES INST9 citations79
US9756240B2Sep 5, 2017
Wide-angle lens calibration system and method thereof
IND TECH RES INST0 citations51
TAIWAN SEMICONDUCTOR MFG CO LTD
3 patentsUS12349268B2Jul 1, 2025
Package component
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11924965B2Mar 5, 2024
Package component and forming method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12553939B2Feb 17, 2026
Interconnect structures in integrated circuit chips
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations56