Inventor · disambiguated record
Jingling Wang
Also filed as: WANG JINGLING
7 granted patents·1 pending application·0 citations·filing 2013–2023
67Inventor score
Files withSEIKO EPSON CORP5UNITED MICROELECTRONICS CORP2JIANGSU YANGTZE TESTING AND CERTIFICATION CO LTD1
Top patents by PatentIndex Score
8 records- 0162US12214592B2Liquid discharge apparatus and method of driving liquid discharge headSEIKO EPSON CORP·Filed 2023·Granted Feb 4, 2025·0 cites·14 claims
- 0259US12280595B2Liquid discharge head and liquid discharge deviceSEIKO EPSON CORP·Filed 2022·Granted Apr 22, 2025·0 cites·12 claims
- 0358US12220916B2Liquid discharge apparatusSEIKO EPSON CORP·Filed 2023·Granted Feb 11, 2025·0 cites·20 claims
- 0452US12064967B2Liquid ejecting head and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2022·Granted Aug 20, 2024·0 cites·16 claims
- 0552US11794474B2Liquid ejecting head and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2021·Granted Oct 24, 2023·0 cites·11 claims
- 0650US11127621B2Method of forming semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2019·Granted Sep 21, 2021·0 cites·14 claims
- 0739US12007351B2Electrode-modified heavy metal ion microfluidic detection chip and preparation methodJIANGSU YANGTZE TESTING AND CERTIFICATION CO LTD·Filed 2020·Granted Jun 11, 2024·0 cites·9 claims
- 0837US2014357050A1Method of forming isolating structure and through silicon viaUNITED MICROELECTRONICS CORP·Filed 2013·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →