Inventor · disambiguated record
Takuya Hando
Also filed as: HANDO TAKUYA
9 granted patents·9 pending applications·35 citations·filing 2000–2024
83Inventor score
Top patents by PatentIndex Score
18 records- 0182US8707554B2Method of manufacturing multilayer wiring substrateMAEDA SHINNOSUKE·Filed 2010·Granted Apr 29, 2014·6 cites·6 claims
- 0280US8581388B2Multilayered wiring substrateMAEDA SHINNOSUKE·Filed 2010·Granted Nov 12, 2013·6 cites·15 claims
- 0377US8233289B2Multilayer wiring substrate and method for manufacturing the sameMAEDA SHINNOSUKE·Filed 2010·Granted Jul 31, 2012·4 cites·9 claims
- 0468US8143534B2Wiring board having solder bump and method for manufacturing the sameHANDO TAKUYA·Filed 2009·Granted Mar 27, 2012·5 cites·4 claims
- 0557US6391422B1Wiring substrate and stiffener thereforNGK SPARK PLUG CO·Filed 2000·Granted May 21, 2002·14 cites·10 claims
- 0656US2025157877A1Semiconductor substrateNITERRA CO LTD·Filed 2024·Application pending·0 cites
- 0751US2014202740A1Method of Manufacturing Multilayer Wiring Substrate, and Multilayer Wiring SubstrateNGK SPARK PLUG CO·Filed 2014·Application pending·0 cites
- 0847US2013161079A1Multi-layer wiring substrate and manufacturing method thereofNGK SPARK PLUG CO·Filed 2012·Application pending·0 cites
- 0946US2013111746A1Method of manufacturing multilayer wiring substrateNGK SPARK PLUG CO·Filed 2012·Application pending·0 cites
- 1046US2010132997A1Multilayer wiring substrate and method for manufacturing the sameHANDO TAKUYA·Filed 2009·Application pending·0 cites
- 1145US10905008B2Wiring boardNGK SPARK PLUG CO·Filed 2018·Granted Jan 26, 2021·0 cites·3 claims
- 1243US9237656B2Method of manufacturing multi-layer wiring boardNGK SPARK PLUG CO·Filed 2012·Granted Jan 12, 2016·0 cites·3 claims
- 1343US2011155438A1Multilayer Wiring SubstrateNGK SPARK PLUG CO·Filed 2010·Application pending·0 cites
- 1442US2009283574A1Solder ball mounting apparatus and wiring board manufacturing methodOKAZAKI RYUICHI·Filed 2009·Application pending·0 cites
- 1541US8866025B2Multilayer wiring boardINOUE MASAHIRO·Filed 2012·Granted Oct 21, 2014·0 cites·4 claims
- 1639US9119333B2Multilayer wiring boardHANDO TAKUYA·Filed 2012·Granted Aug 25, 2015·0 cites·3 claims
- 1732US2015366058A1Wiring substrate and method for producing the sameNGK SPARK PLUG CO·Filed 2015·Application pending·0 cites
- 1832US2015364410A1Circuit board, manufacturing method therefor, and pillar-shaped terminal for circuit boardNGK SPARK PLUG CO·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →