P

Inventor

HENLEY FRANCOIS J

US147 patents
⚠️ This page may combine multiple inventors who share the name “HENLEY FRANCOIS J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SILICON GENESIS CORP

46 patents
US7674687B2Mar 9, 2010

Method and structure for fabricating multiple tiled regions onto a plate using a controlled cleaving process

SILICON GENESIS CORP300 citations99
US7371660B2May 13, 2008

Controlled cleaving process

SILICON GENESIS CORP289 citations99
US7351644B2Apr 1, 2008

Thin handle substrate method and structure for fabricating devices using one or more films provided by a layer transfer process

SILICON GENESIS CORP290 citations99
US7166520B1Jan 23, 2007

Thin handle substrate method and structure for fabricating devices using one or more films provided by a layer transfer process

SILICON GENESIS CORP385 citations99
US7160790B2Jan 9, 2007

Controlled cleaving process

SILICON GENESIS CORP70 citations99
US6790747B2Sep 14, 2004

Method and device for controlled cleaving process

SILICON GENESIS CORP239 citations99
US6632724B2Oct 14, 2003

Controlled cleaving process

SILICON GENESIS CORP163 citations99
US6548382B1Apr 15, 2003

Gettering technique for wafers made using a controlled cleaving process

SILICON GENESIS CORP162 citations99
US6528391B1Mar 4, 2003

Controlled cleavage process and device for patterned films

SILICON GENESIS CORP422 citations99
US6511899B1Jan 28, 2003

Controlled cleavage process using pressurized fluid

SILICON GENESIS CORP133 citations99
US6486041B2Nov 26, 2002

Method and device for controlled cleaving process

SILICON GENESIS CORP124 citations99
US6458672B1Oct 1, 2002

Controlled cleavage process and resulting device using beta annealing

SILICON GENESIS CORP84 citations99
US6448152B1Sep 10, 2002

Method and system for generating a plurality of donor wafers and handle wafers prior to an order being placed by a customer

SILICON GENESIS CORP149 citations99
US6391740B1May 21, 2002

Generic layer transfer methodology by controlled cleavage process

SILICON GENESIS CORP163 citations99
US6321134B1Nov 20, 2001

Clustertool system software using plasma immersion ion implantation

SILICON GENESIS CORP357 citations99
US6290804B1Sep 18, 2001

Controlled cleavage process using patterning

SILICON GENESIS CORP121 citations99
US6284631B1Sep 4, 2001

Method and device for controlled cleaving process

SILICON GENESIS CORP86 citations99
US6245161B1Jun 12, 2001

Economical silicon-on-silicon hybrid wafer assembly

SILICON GENESIS CORP127 citations99
US6207005B1Mar 27, 2001

Cluster tool apparatus using plasma immersion ion implantation

SILICON GENESIS CORP209 citations99
US6187110B1Feb 13, 2001

Device for patterned films

SILICON GENESIS CORP123 citations99
US6184111B1Feb 6, 2001

Pre-semiconductor process implant and post-process film separation

SILICON GENESIS CORP251 citations99
US6162705ADec 19, 2000

Controlled cleavage process and resulting device using beta annealing

SILICON GENESIS CORP113 citations99
US6159824ADec 12, 2000

Silicon-on-silicon wafer bonding process using a thin film blister-separation method

SILICON GENESIS CORP188 citations99
US6153524ANov 28, 2000

Cluster tool method using plasma immersion ion implantation

SILICON GENESIS CORP150 citations99
US6146979ANov 14, 2000

Pressurized microbubble thin film separation process using a reusable substrate

SILICON GENESIS CORP292 citations99
US6103599AAug 15, 2000

Planarizing technique for multilayered substrates

SILICON GENESIS CORP206 citations99
US6083324AJul 4, 2000

Gettering technique for silicon-on-insulator wafers

SILICON GENESIS CORP252 citations99
US6048411AApr 11, 2000

Silicon-on-silicon hybrid wafer assembly

SILICON GENESIS CORP266 citations99
US6033974AMar 7, 2000

Method for controlled cleaving process

SILICON GENESIS CORP386 citations99
US6013567AJan 11, 2000

Controlled cleavage process using pressurized fluid

SILICON GENESIS CORP154 citations99
US6013563AJan 11, 2000

Controlled cleaning process

SILICON GENESIS CORP330 citations99
US6010579AJan 4, 2000

Reusable substrate for thin film separation

SILICON GENESIS CORP254 citations99
US5994207ANov 30, 1999

Controlled cleavage process using pressurized fluid

SILICON GENESIS CORP244 citations99
US5985742ANov 16, 1999

Controlled cleavage process and device for patterned films

SILICON GENESIS CORP493 citations99
US7759220B2Jul 20, 2010

Method and structure for fabricating solar cells using a layer transfer process

SILICON GENESIS CORP61 citations98
US7348258B2Mar 25, 2008

Method and device for controlled cleaving process

SILICON GENESIS CORP55 citations98
US7056808B2Jun 6, 2006

Cleaving process to fabricate multilayered substrates using low implantation doses

SILICON GENESIS CORP121 citations98
US6890838B2May 10, 2005

Gettering technique for wafers made using a controlled cleaving process

SILICON GENESIS CORP71 citations98
US6582999B2Jun 24, 2003

Controlled cleavage process using pressurized fluid

SILICON GENESIS CORP109 citations98
US6291313B1Sep 18, 2001

Method and device for controlled cleaving process

SILICON GENESIS CORP137 citations98
US6558802B1May 6, 2003

Silicon-on-silicon hybrid wafer assembly

SILICON GENESIS CORP59 citations97
US6335264B1Jan 1, 2002

Controlled cleavage thin film separation process using a reusable substrate

SILICON GENESIS CORP60 citations97
US6294814B1Sep 25, 2001

Cleaved silicon thin film with rough surface

SILICON GENESIS CORP54 citations97
US6159825ADec 12, 2000

Controlled cleavage thin film separation process using a reusable substrate

SILICON GENESIS CORP74 citations97
US6155909ADec 5, 2000

Controlled cleavage system using pressurized fluid

SILICON GENESIS CORP80 citations97
US6500732B1Dec 31, 2002

Cleaving process to fabricate multilayered substrates using low implantation doses

SILICON GENESIS CORP150 citations96

PHOTON DYNAMICS INC

4 patents

Showing the top 50 of 147 patents by PatentIndex Score.