Inventor · disambiguated record
Hejin Liu
Also filed as: LIU HEJIN
5 granted patents·1 pending application·8 citations·filing 2010–2014
69Inventor score
Top patents by PatentIndex Score
6 records- 0167US8288847B2Dual die semiconductor packageHuang meiquan·Filed 2010·Granted Oct 16, 2012·4 cites·11 claims
- 0261US8496158B2Method and apparatus for monitoring free air ball (FAB) formation in wire bondingZONG FEI·Filed 2012·Granted Jul 30, 2013·3 cites·15 claims
- 0358US8907464B2Helix substrate and three-dimensional package with sameWANG HUAN·Filed 2013·Granted Dec 9, 2014·1 cites·8 claims
- 0452US9209119B1Semiconductor device assembled using two lead framesWANG HUAN·Filed 2014·Granted Dec 8, 2015·0 cites·3 claims
- 0535US8524529B2Brace for wire bondHuang meiquan·Filed 2011·Granted Sep 3, 2013·0 cites·13 claims
- 0634US2012326288A1Method of assembling semiconductor deviceHuang meiquan·Filed 2012·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →