P

Inventor

TAKEUCHI MASAHIRO

JP71 patents
⚠️ This page may combine multiple inventors who share the name “TAKEUCHI MASAHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SEIKO EPSON CORP

16 patents
US6713886B2Mar 30, 2004

Semiconductor device

SEIKO EPSON CORP29 citations93
US6657243B2Dec 2, 2003

Semiconductor device with SRAM section including a plurality of memory cells

SEIKO EPSON CORP30 citations93
US6469356B2Oct 22, 2002

Semiconductor memory device having different distances between gate electrode layers

SEIKO EPSON CORP22 citations93
US5060033AOct 22, 1991

Semiconductor device and method of producing semiconductor device

SEIKO EPSON CORP21 citations82
US6507124B2Jan 14, 2003

Semiconductor memory device

SEIKO EPSON CORP10 citations74
US6469400B2Oct 22, 2002

Semiconductor memory device

SEIKO EPSON CORP7 citations74
US5147814ASep 15, 1992

Method of manufacturing an lddfet having an inverted-t shaped gate electrode

SEIKO EPSON CORP12 citations74
US5097300AMar 17, 1992

Semiconductor device and manufacturing method thereof

SEIKO EPSON CORP10 citations74
US5831285ANov 3, 1998

Semiconductor static random access memory device

SEIKO EPSON CORP13 citations72
US6538338B2Mar 25, 2003

Static RAM semiconductor memory device having reduced memory

SEIKO EPSON CORP5 citations63
US6455899B2Sep 24, 2002

Semiconductor memory device having improved pattern of layers and compact dimensions

SEIKO EPSON CORP6 citations63
US6407463B2Jun 18, 2002

Semiconductor memory device having gate electrode, drain-drain contact, and drain-gate contact layers

SEIKO EPSON CORP6 citations63
US6347048B2Feb 12, 2002

Semiconductor memory device

SEIKO EPSON CORP5 citations63
US5180682AJan 19, 1993

Semiconductor device and method of producing semiconductor device

SEIKO EPSON CORP3 citations63
US11123984B2Sep 21, 2021

Liquid ejecting head, method for manufacturing liquid ejecting head, and liquid ejecting system

SEIKO EPSON CORP0 citations52
US7129148B2Oct 31, 2006

Methods for manufacturing semiconductor devices and semiconductor devices having trench isolation regions

SEIKO EPSON CORP1 citations52

NEC ELECTRONICS CORP

4 patents

SUMITOMO BAKELITE CO

4 patents

RENESAS ELECTRONICS CORP

3 patents

HONDA MOTOR CO LTD

2 patents

JATCO CORP

2 patents

TAKEUCHI MASAHIRO

2 patents

MARUHO HATSUJYO KOGYO LTD

1 patent

NEC CORP

1 patent

TERUMO CORP

1 patent

FUJIKOSHI KIKAI KOGYO KK

1 patent

IKEGAMI TAKEFUMI

1 patent

FUJIKOSHI MACHINERY CORP

1 patent

HITACHI HIGH TECH SCIENCE SYS

1 patent

NIHON KOHDEN CORP

1 patent

(unassigned)

1 patent

YOSHIMURA SHIGEHIRO

1 patent

AISIN CORP

1 patent

SOCIONEXT INC

1 patent

TSUNEISHI JUNYA

1 patent

SONY CORP

1 patent

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

1 patent

JAPAN SCIENCE & TECH AGENCY

1 patent

UNIV OF OCCUPATIONAL AND ENVIRONMENTAL HEALTH JAPAN

1 patent

Showing the top 50 of 71 patents by PatentIndex Score.