Inventor
TAKEUCHI MASAHIRO
JP71 patents
⚠️ This page may combine multiple inventors who share the name “TAKEUCHI MASAHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SEIKO EPSON CORP
16 patentsUS6713886B2Mar 30, 2004
Semiconductor device
SEIKO EPSON CORP29 citations93
US6657243B2Dec 2, 2003
Semiconductor device with SRAM section including a plurality of memory cells
SEIKO EPSON CORP30 citations93
US6469356B2Oct 22, 2002
Semiconductor memory device having different distances between gate electrode layers
SEIKO EPSON CORP22 citations93
US5060033AOct 22, 1991
Semiconductor device and method of producing semiconductor device
SEIKO EPSON CORP21 citations82
US6507124B2Jan 14, 2003
Semiconductor memory device
SEIKO EPSON CORP10 citations74
US6469400B2Oct 22, 2002
Semiconductor memory device
SEIKO EPSON CORP7 citations74
US5147814ASep 15, 1992
Method of manufacturing an lddfet having an inverted-t shaped gate electrode
SEIKO EPSON CORP12 citations74
US5097300AMar 17, 1992
Semiconductor device and manufacturing method thereof
SEIKO EPSON CORP10 citations74
US5831285ANov 3, 1998
Semiconductor static random access memory device
SEIKO EPSON CORP13 citations72
US6538338B2Mar 25, 2003
Static RAM semiconductor memory device having reduced memory
SEIKO EPSON CORP5 citations63
US6455899B2Sep 24, 2002
Semiconductor memory device having improved pattern of layers and compact dimensions
SEIKO EPSON CORP6 citations63
US6407463B2Jun 18, 2002
Semiconductor memory device having gate electrode, drain-drain contact, and drain-gate contact layers
SEIKO EPSON CORP6 citations63
US6347048B2Feb 12, 2002
Semiconductor memory device
SEIKO EPSON CORP5 citations63
US5180682AJan 19, 1993
Semiconductor device and method of producing semiconductor device
SEIKO EPSON CORP3 citations63
US11123984B2Sep 21, 2021
Liquid ejecting head, method for manufacturing liquid ejecting head, and liquid ejecting system
SEIKO EPSON CORP0 citations52
US7129148B2Oct 31, 2006
Methods for manufacturing semiconductor devices and semiconductor devices having trench isolation regions
SEIKO EPSON CORP1 citations52
NEC ELECTRONICS CORP
4 patentsUS7253754B2Aug 7, 2007
Data form converter between serial and parallel
NEC ELECTRONICS CORP27 citations93
US7715514B2May 11, 2010
Clock and data recovery circuit
NEC ELECTRONICS CORP17 citations84
US7672406B2Mar 2, 2010
Clock and data recovery circuit and SERDES circuit
NEC ELECTRONICS CORP15 citations84
US7733120B2Jun 8, 2010
Impedance adjustment circuit
NEC ELECTRONICS CORP9 citations83
SUMITOMO BAKELITE CO
4 patentsUS4404162ASep 13, 1983
Process for producing a thin-wall deep drawn container of thermoplastic resin
SUMITOMO BAKELITE CO54 citations92
US4118454AOct 3, 1978
Method for producing transparent plastic molded articles
SUMITOMO BAKELITE CO27 citations80
US4176154ANov 27, 1979
Method for thermoforming plastic sheets
SUMITOMO BAKELITE CO12 citations72
US4140457AFeb 20, 1979
Method for producing transparent plastic molded articles and thermoforming apparatus therefor
SUMITOMO BAKELITE CO16 citations72
RENESAS ELECTRONICS CORP
3 patentsHONDA MOTOR CO LTD
2 patentsJATCO CORP
2 patentsTAKEUCHI MASAHIRO
2 patentsMARUHO HATSUJYO KOGYO LTD
1 patentNEC CORP
1 patentTERUMO CORP
1 patentFUJIKOSHI KIKAI KOGYO KK
1 patentIKEGAMI TAKEFUMI
1 patentFUJIKOSHI MACHINERY CORP
1 patentHITACHI HIGH TECH SCIENCE SYS
1 patentNIHON KOHDEN CORP
1 patent(unassigned)
1 patentYOSHIMURA SHIGEHIRO
1 patentAISIN CORP
1 patentSOCIONEXT INC
1 patentTSUNEISHI JUNYA
1 patentSONY CORP
1 patentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD
1 patentJAPAN SCIENCE & TECH AGENCY
1 patentUNIV OF OCCUPATIONAL AND ENVIRONMENTAL HEALTH JAPAN
1 patentShowing the top 50 of 71 patents by PatentIndex Score.