Inventor
CHAUHAN SATYENDRA S
US10 patents
⚠️ This page may combine multiple inventors who share the name “CHAUHAN SATYENDRA S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TEXAS INSTRUMENTS INC
6 patentsUS7057284B2Jun 6, 2006
Fine pitch low-cost flip chip substrate
TEXAS INSTRUMENTS INC92 citations97
US6849944B2Feb 1, 2005
Using a supporting structure to control collapse of a die towards a die pad during a reflow process for coupling the die to the die pad
TEXAS INSTRUMENTS INC107 citations96
US8053873B2Nov 8, 2011
IC having voltage regulated integrated Faraday shield
TEXAS INSTRUMENTS INC7 citations83
US7790597B2Sep 7, 2010
Solder cap application process on copper bump using solder powder film
TEXAS INSTRUMENTS INC7 citations70
US7883936B2Feb 8, 2011
Multi layer low cost cavity substrate fabrication for PoP packages
TEXAS INSTRUMENTS INC3 citations59
US7323405B2Jan 29, 2008
Fine pitch low cost flip chip substrate
TEXAS INSTRUMENTS INC0 citations51
DUNNE RAJIV
3 patentsUS8178976B2May 15, 2012
IC device having low resistance TSV comprising ground connection
DUNNE RAJIV18 citations91
US8431481B2Apr 30, 2013
IC device having low resistance TSV comprising ground connection
DUNNE RAJIV4 citations61
US8436475B2May 7, 2013
IC device having low resistance TSV comprising ground connection
DUNNE RAJIV0 citations50