P

Inventor

MORRISON GARY P

US7 patents
⚠️ This page may combine multiple inventors who share the name “MORRISON GARY P”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DUNNE RAJIV

3 patents
US8178976B2May 15, 2012

IC device having low resistance TSV comprising ground connection

DUNNE RAJIV18 citations91
US8431481B2Apr 30, 2013

IC device having low resistance TSV comprising ground connection

DUNNE RAJIV4 citations61
US8436475B2May 7, 2013

IC device having low resistance TSV comprising ground connection

DUNNE RAJIV0 citations50

TEXAS INSTRUMENTS INC

3 patents
US6762498B1Jul 13, 2004

Ball grid array package for high speed devices

TEXAS INSTRUMENTS INC19 citations91
US7462783B2Dec 9, 2008

Semiconductor package having a grid array of pin-attached balls

TEXAS INSTRUMENTS INC9 citations79
US7790597B2Sep 7, 2010

Solder cap application process on copper bump using solder powder film

TEXAS INSTRUMENTS INC7 citations70

BONIFIELD THOMAS D

1 patent
US8154134B2Apr 10, 2012

Packaged electronic devices with face-up die having TSV connection to leads and die pad

BONIFIELD THOMAS D15 citations79