Inventor · disambiguated record
Bona Baek
Also filed as: BAEK BONA
5 granted patents·2 pending applications·23 citations·filing 2013–2024
76Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0191US9425156B2Semiconductor packages having semiconductor chips disposed in opening in shielding core plateSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Aug 23, 2016·11 cites·22 claims
- 0283US10825776B2Semiconductor packages having semiconductor chips disposed in opening in shielding core plateSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 3, 2020·3 cites·18 claims
- 0381US9252095B2Semiconductor package and method of fabricating the sameKIM JONGKOOK·Filed 2013·Granted Feb 2, 2016·7 cites·28 claims
- 0476US10211159B2Semiconductor packages having semiconductor chips disposed in opening in shielding core plateSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Feb 19, 2019·2 cites·20 claims
- 0557US2024379545A1Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0642US10163838B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Dec 25, 2018·0 cites·16 claims
- 0741US2016111347A1Semiconductor package and method of fabricating the sameKIM JONGKOOK·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →