Inventor

SUGANO TOSHIO

JP58 patents

⚠️ This page may combine multiple inventors who share the name “SUGANO TOSHIO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SUGANO TOSHIO

HITACHI LTD

Stacked semiconductor device including improved lead frame arrangement

Stacked semiconductor device including improved lead frame arrangement

Semiconductor integrated circuit device and method of manufacturing the same

Directional coupling memory module

Stacked semiconductor memory device and semiconductor memory module containing the same

Semiconductor stacked device

Semiconductor device, a semiconductor module loaded with said semiconductor device and a method of manufacturing said semiconductor device

Semiconductor memory module having double-sided stacked memory chip layout

Semiconductor device

Semiconductor device

Semiconductor device and process for manufacturing the same

Semiconductor device and process for manufacturing the same

Semiconductor device and process for manufacturing the same

Semiconductor integrated circuit device, and process and apparatus for manufacturing the same

Double-sided memory board

Semiconductor device and semiconductor module with a plurality of stacked semiconductor devices

Stacked semiconductor device including improved lead frame arrangement

Semiconductor memory device and memory module using the same

Bus system, memory system, printed circuit board and directional coupler

Semiconductor device and process for manufacturing the same

Directional coupling memory module

Memory module and an IC card

High packing density module board and electronic device having such module board

Semiconductor device

Memory-Module with an increased density for mounting semiconductor chips

Register capable of corresponding to wide frequency band and signal generating method using the same

Semiconductor device

Surface mount-type package of ball grid array with multi-chip mounting

Semiconductor memory device and memory module using the same

ELPIDA MEMORY INC

Memory module and memory system

Stacked semiconductor package

Memory module and memory system

Register without restriction of number of mounted memory devices and memory module having the same

Memory module and memory device

Memory module

Memory module including plural memory devices and data register buffer

Semiconductor device and a memory system including a plurality of IC chips in a common package

Signal transmission circuit and characteristic adjustment method thereof, memory module, and manufacturing method of circuit board

SAITO SHUNICHI

Load reduced memory module and memory system including the same

Multi-layer printed wiring board

MATSUI YOSHINORI

Memory module and memory system

Memory module and memory system

HITACHI ULSI SYS CO LTD

Semiconductor device and a memory system including a plurality of IC chips in a common package

Stacked semiconductor device including improved lead frame arrangement

PS4 LUXCO SARL

Semiconductor device having ODT function

Memory module and memory system

EPIDA MEMORY INC

Memory module and memory device

HIRAISHI ATSUSHI

Address line wiring structure and printed wiring board having same

MICRON TECHNOLOGY INC

Apparatuses and methods for a memory device with dual common data I/O lines

LONGITUDE SEMICONDUCTOR SARL

Memory module and memory system