Inventor
VAN GEMERT LEONARDUS ANTONIUS ELISABETH
NL12 patents
Patents
12 patentsUS9466585B1Oct 11, 2016
Reducing defects in wafer level chip scale package (WLCSP) devices
NXP BV17 citations90
US9196537B2Nov 24, 2015
Protection of a wafer-level chip scale package (WLCSP)
NXP BV6 citations82
US8987057B2Mar 24, 2015
Encapsulated wafer-level chip scale (WLSCP) pedestal packaging
NXP BV8 citations82
US10177111B2Jan 8, 2019
Reduction of defects in wafer level chip scale package (WLCSP) devices
NXP BV10 citations81
US9704823B2Jul 11, 2017
Reduction of defects in wafer level chip scale package (WLCSP) devices
NXP BV8 citations81
US9245804B2Jan 26, 2016
Using a double-cut for mechanical protection of a wafer-level chip scale package (WLCSP)
NXP BV4 citations71
US9653414B2May 16, 2017
Shielded QFN package and method of making
NXP BV2 citations70
US8895357B2Nov 25, 2014
Integrated circuit and method of manufacturing the same
NXP BV2 citations60
US9385099B2Jul 5, 2016
Die interconnect
NXP BV1 citations50
US10096555B2Oct 9, 2018
Shielded QFN package and method of making
NXP BV0 citations49
US9263299B2Feb 16, 2016
Exposed die clip bond power package
NXP BV1 citations43
US9953903B2Apr 24, 2018
Heatsink very-thin quad flat no-leads (HVQFN) package
NXP BV0 citations34