Exposed die clip bond power package

Abstract

In an example embodiment, an integrated circuit (IC) comprises a device die having a top-side surface and an under-side surface, the top-side surface having bond pads connected to active circuit elements, the under-side surface having a conductive surface. A first set of lead frame clips having upper portions and lower portions, are solder-anchored, on the upper portions, to a first set of bond pads; the lower portions are flush with the conductive surface. Wires are bonded to an additional set of bond pads opposite the first set of bond pads and to lower lead frame portions of a second set of lead frame clips opposite the first set of lead frame clips; the lower lead frame portions of the second set of lead frame clips are flush with the conductive surface. The device is encapsulated in a molding compound leaving exposed the conductive surface and underside surfaces of the first and second sets of the lead frame portions.

The invention claimed is: 
     
       1. A method for packaging an integrated circuit (IC) device, the method comprising:
 mounting a plurality of active device die, into predetermined positions, onto a temporary carrier, each said active device die having bond pads, each of said active device die having a solderable conductive surface on its underside; and having been subjected to back-grinding to a prescribed thickness; 
 dispensing a solder paste onto the bond pads on the plurality active device die; 
 attaching a lead frame to the temporary carrier, the lead frame having an array of device positions which correspond to the predetermined positions of the plurality of active device die, wherein upper lead frame portions contact the solder paste present on the bond pads and lower lead frame portions contact the temporary carrier; and 
 reflowing the solder so that a connection is made between the upper lead frame portions and the bond pads of the plurality of active device die. 
 
     
     
       2. The method as recited in  claim 1 , wherein the lead frame is comprised of two or more lead frame strips of clips. 
     
     
       3. The method as recited in  claim 1 , further comprising:
 wire bonding from additional bond pads opposite the bond pads on each of the active device die to additional lower lead frame portions adjacent to the additional bond pads. 
 
     
     
       4. The method as recited in  claim 1 , further comprising:
 encapsulating the plurality of active device die attached to the lead frame in a molding compound; 
 removing the temporary carrier; and 
 singulating the plurality of molded device die into individual devices. 
 
     
     
       5. The method as recited in  claim 1 , wherein the temporary carrier is at least one of the following:
 a carrier tape stretched in a carrier ring apparatus; 
 a carrier tape attached to a support plate. 
 
     
     
       6. The method as recited in  claim 1 , wherein the solderable conductive surface includes: NiAu, Ni, Cu, Au, NiPdAu, AuSn, NiSn, CuSn, Ag, AgSn or alloys thereof. 
     
     
       7. A method for packaging an integrated circuit (IC) device from a semiconductor wafer substrate, the wafer substrate having a top-side surface with a plurality active device die defined thereon, and an under-side surface, the method comprising:
 backgrinding the under-side surface of the wafer substrate to a prescribed thickness; 
 applying a solderable conductive surface to the under-side surface of the wafer substrate; 
 separating out the plurality active device die from the semiconductor wafer substrate, each of the active device die having bond pads, the bond pads providing electrical connection to circuit elements in the active device die; 
 mounting the plurality of active device die, into predetermined positions, onto a temporary carrier; 
 dispensing a solder paste onto the bond pads on the plurality active device die; 
 attaching individual lead frame portions to the temporary carrier and bond pads, wherein upper individual lead frame portions contact the solder paste present on the bond pads and lower individual lead frame portions contact the temporary carrier; and 
 reflowing the solder so that a connection is made between the upper lead frame portions and the bond pads of the plurality of active device die. 
 
     
     
       8. The method as recited in  claim 7 , wherein the temporary carrier is at least one of the following:
 a carrier tape stretched in a carrier ring apparatus; 
 a carrier tape attached to a support plate. 
 
     
     
       9. The method as recited in  claim 8 , further comprising:
 wire bonding from additional bond pads opposite the bond pads on each of the active device die to additional lower individual lead frame portions adjacent to the additional bond pads. 
 
     
     
       10. The method as recited in  claim 8 , further comprising:
 encapsulating the plurality of active device die attached to the lead frame in a molding compound; 
 removing the temporary carrier; and 
 singulating the plurality of molded device die into individual devices.