Inventor
HUANG CHIEN-WEN
TW12 patents
⚠️ This page may combine multiple inventors who share the name “HUANG CHIEN-WEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
POWERTECH TECHNOLOGY INC
4 patentsUS9412703B1Aug 9, 2016
Chip package structure having a shielded molding compound
POWERTECH TECHNOLOGY INC8 citations83
US10431549B2Oct 1, 2019
Semiconductor package and manufacturing method thereof
POWERTECH TECHNOLOGY INC2 citations71
US9825010B2Nov 21, 2017
Stacked chip package structure and manufacturing method thereof
POWERTECH TECHNOLOGY INC4 citations71
US10950557B2Mar 16, 2021
Stacked chip package structure and manufacturing method thereof
POWERTECH TECHNOLOGY INC0 citations50
MICRON TECHNOLOGY INC
3 patentsUS11894327B2Feb 6, 2024
Apparatus including integrated segments and methods of manufacturing the same
MICRON TECHNOLOGY INC2 citations72
US12593719B2Mar 31, 2026
Apparatus including integrated segments and methods of manufacturing the same
MICRON TECHNOLOGY INC0 citations62
US12068282B2Aug 20, 2024
Hybrid metallic structures in stacked semiconductor devices and associated systems and methods
MICRON TECHNOLOGY INC0 citations49
RADIANT INNOVATION INC
2 patentsUS12078544B2Sep 3, 2024
Temperature calibration method of infrared thermal image camera and calibration method of temperature sensing system of infrared thermal image camera
RADIANT INNOVATION INC0 citations50
US11543298B1Jan 3, 2023
Temperature calibration method for a temperature measuring device
RADIANT INNOVATION INC0 citations50