Inventor
SOHN HAI-JEONG
KR9 patents
Patents
9 patentsUSD432096SOct 17, 2000
Semiconductor module
SAMSUNG ELECTRONICS CO LTD48 citations96
US6724074B2Apr 20, 2004
Stack semiconductor chip package and lead frame
SAMSUNG ELECTRONICS CO LTD66 citations95
US5428247AJun 27, 1995
Down-bonded lead-on-chip type semiconductor device
SAMSUNG ELECTRONICS CO LTD56 citations95
USD432097SOct 17, 2000
Semiconductor package
SAMSUNG ELECTRONICS CO LTD42 citations92
US7480776B2Jan 20, 2009
Circuits and methods for providing variable data I/O width for semiconductor memory devices
SAMSUNG ELECTRONICS CO LTD8 citations83
US6319828B1Nov 20, 2001
Method for manufacturing a chip scale package having copper traces selectively plated with gold
SAMSUNG ELECTRONICS CO LTD18 citations83
US5933708AAug 3, 1999
Lead-on-chip semiconductor package and method for making the same
SAMSUNG ELECTRONICS CO LTD13 citations73
US5811875ASep 22, 1998
Lead frames including extended tie-bars, and semiconductor chip packages using same
SAMSUNG ELECTRONICS CO LTD11 citations71
US6573611B1Jun 3, 2003
Dual-lead type square semiconductor package and dual in-line memory module using the same
SAMSUNG ELECTRONICS CO LTD4 citations62