Inventor

MATAYABAS JR JAMES C

US57 patents

⚠️ This page may combine multiple inventors who share the name “MATAYABAS JR JAMES C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MATAYABAS JR JAMES C

INTEL CORP

In-situ functionalization of carbon nanotubes

In-situ functionalization of carbon nanotubes

Electronic packages having good reliability comprising low modulus thermal interface materials

Thermal management systems for micro-components

Through-die metal vias with a dispersed phase of graphitic structures of carbon for reduced thermal expansion and increased electrical conductance

Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials

Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials

Chain extension for thermal materials

Polymer thermal interface material having enhanced thermal conductivity

Chain extension for thermal materials

Package stress management

Multiple-chip package with multiple thermal interface materials

Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applications

Thermoset polyimides for microelectronic applications

Polymer thermal interface material having enhanced thermal conductivity

Package stress management

LPS solder paste based low cost fine pitch pop interconnect solutions

Multi-chip packages and sinterable paste for use with thermal interface materials

Dielectric film with low coefficient of thermal expansion (CTE) using liquid crystalline resin

Chain extension for thermal materials

Component packaging apparatus, systems, and methods

Formation of holes in substrates using dewetting coatings

Plastic materials including dendrimers or hyperbranched polymers for integrated circuit packaging

Thermal management solutions for integrated circuit packages

Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials

Microelectronic package having electromagnetic interference shielding

LPS solder paste based low cost fine pitch pop interconnect solutions

Carbon based polymer thermal interface materials with polymer chain to carbon based fill particle bonds

Component packaging apparatus, systems, and methods

Integrated heat spreader with enhanced vapor chamber for multichip packages

Flexible electronic assembly method

Controlled fluid delivery in a microelectronic package

Polymer device with a nanocomposite barrier layer

Methods for fabricating thermal management systems for micro-components

Space transformer with perforated metallic plate for electrical die test

EASTMAN CHEM CO

Preparation of polyether glycols and alcohols by the polymerization 3,4-epoxy-1-butene

Polyether glycols and alcohols derived from 3,4-epoxy-1-butene

Polyether glycols and alcohols derived from 3,4-epoxy-1-butene

Polyether polymers derived from 3,4-epxoy-1-butene

Polyether polymers derived from 3,4-epoxy-1-butene

Polyether glycols and alcohols derived form 3,4-epoxy-1-butene, tetrahydrofuran and an initiator

Polyether glycols and alcohols derived from 3,4-epoxy-1-butene, tetrahydrofuran and an initiator

Process for producing saturated polyether glycols and alcohols derived from 3, 4-epoxy-1-butene

Polyether polymers derived from 3,4-epoxy-1-butene and hydroxyl initiator

Copolyester-ether polymers

MATAYABAS JR JAMES C

Thermoset polymides for microelectronic applications

Dielectric film with low coefficient of thermal expansion (CTE) using liquid crystalline resin

ARORA HITESH

Thermal interface material composition including polymeric matrix and carbon filler

DE BONIS THOMAS J

Package structure to enhance yield of TMI interconnections

SUPRIYA LAKSHMI

Controlled fluid delivery in a microelectronic package