Inventor
HAN WON-GIL
KR11 patents
⚠️ This page may combine multiple inventors who share the name “HAN WON-GIL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
9 patentsUS10147706B2Dec 4, 2018
Multi-chip package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD4 citations69
US10784244B2Sep 22, 2020
Semiconductor package including multiple semiconductor chips and method of manufacturing the semiconductor package
SAMSUNG ELECTRONICS CO LTD5 citations68
US9252123B2Feb 2, 2016
Multi-chip package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD5 citations67
US11594500B2Feb 28, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations56
US10903177B2Jan 26, 2021
Method of manufacturing a semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations56
US10886253B2Jan 5, 2021
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations49
US10679972B2Jun 9, 2020
Method of manufacturing multi-chip package
SAMSUNG ELECTRONICS CO LTD0 citations48
US9384105B2Jul 5, 2016
Method of detecting faults of operation algorithms in a wire bonding machine and apparatus for performing the same
SAMSUNG ELECTRONICS CO LTD0 citations46
US10658326B2May 19, 2020
Bonding wire having a silver alloy core, wire bonding method using the bonding wire, and electrical connection part of semiconductor device using the bonding wire
SAMSUNG ELECTRONICS CO LTD0 citations45