Inventor · disambiguated record
Daigo Ichinose
Also filed as: ICHINOSE DAIGO
16 granted patents·9 pending applications·66 citations·filing 2009–2024
90Inventor score
Top patents by PatentIndex Score
25 records- 0190US8723247B2Semiconductor memory device and method for manufacturing sameKOMORI YOSUKE·Filed 2011·Granted May 13, 2014·13 cites·8 claims
- 0288US10522460B2Memory device and method for manufacturing sameTOSHIBA MEMORY CORP·Filed 2017·Granted Dec 31, 2019·7 cites·13 claims
- 0388US8946809B2Method for manufacturing semiconductor memory device and semiconductor memory deviceTOSHIBA KK·Filed 2013·Granted Feb 3, 2015·11 cites·20 claims
- 0486US7986000B2Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2009·Granted Jul 26, 2011·13 cites·19 claims
- 0582US8791524B2Method for manufacturing nonvolatile semiconductor memory device and nonvolatile semiconductor memory deviceICHINOSE DAIGO·Filed 2012·Granted Jul 29, 2014·8 cites·4 claims
- 0679US10242993B2Semiconductor device and method for manufacturing sameTOSHIBA MEMORY CORP·Filed 2017·Granted Mar 26, 2019·3 cites·16 claims
- 0778US9831180B2Semiconductor device and method for manufacturing sameTOSHIBA MEMORY CORP·Filed 2016·Granted Nov 28, 2017·3 cites·16 claims
- 0877US8436416B2Nonvolatile semiconductor memory device and method for manufacturing sameICHINOSE DAIGO·Filed 2010·Granted May 7, 2013·5 cites·21 claims
- 0967US2025294766A1Memory deviceKIOXIA CORP·Filed 2024·Application pending·0 cites
- 1066US9570461B2Method for manufacturing semiconductor memory deviceTOSHIBA KK·Filed 2015·Granted Feb 14, 2017·1 cites·16 claims
- 1163US8692311B2Method for manufacturing semiconductor deviceSHINOHARA HIROSHI·Filed 2011·Granted Apr 8, 2014·2 cites·17 claims
- 1262US2025107088A1Semiconductor memory deviceKIOXIA CORP·Filed 2024·Application pending·0 cites
- 1356US11309325B2Nonvolatile semiconductor memory device and method of manufacturing the sameKIOXIA CORP·Filed 2020·Granted Apr 19, 2022·0 cites·9 claims
- 1454US12317490B2Semiconductor memory deviceKIOXIA CORP·Filed 2022·Granted May 27, 2025·0 cites·20 claims
- 1551US12349347B2Three-dimensional memory stack structure with source line including an insulating dividing portionKIOXIA CORP·Filed 2021·Granted Jul 1, 2025·0 cites·14 claims
- 1650US2023072833A1Semiconductor memory deviceKIOXIA CORP·Filed 2022·Application pending·0 cites
- 1747US11711919B2Semiconductor memory deviceKIOXIA CORP·Filed 2020·Granted Jul 25, 2023·0 cites·14 claims
- 1847US8062980B2Method of fabricating semiconductor deviceICHINOSE DAIGO·Filed 2009·Granted Nov 22, 2011·0 cites·17 claims
- 1947US2022068803A1Semiconductor storage deviceKIOXIA CORP·Filed 2021·Application pending·0 cites
- 2045US2016268269A1Nonvolatile semiconductor memory device and method of manufacturing the sameTOSHIBA KK·Filed 2015·Application pending·0 cites
- 2144US11417677B2Semiconductor memory deviceKIOXIA CORP·Filed 2020·Granted Aug 16, 2022·0 cites·20 claims
- 2232US2017103992A1Semiconductor memory device and method of manufacturing the sameTOSHIBA KK·Filed 2016·Application pending·0 cites
- 2331US2017069655A1Semiconductor memory device and method for manufacturing the sameTOSHIBA KK·Filed 2016·Application pending·0 cites
- 2426US2015255485A1Nonvolatile semiconductor storage deviceTOSHIBA KK·Filed 2015·Application pending·0 cites
- 2526US2015255486A1Nonvolatile semiconductor storage deviceTOSHIBA KK·Filed 2015·Application pending·0 cites
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