Inventor · disambiguated record
Reynaldo Co
Also filed as: CO REYNALDO
36 granted patents·1 pending application·909 citations·filing 2008–2024
98Inventor score
Top patents by PatentIndex Score
37 records- 0199US8878353B2Structure for microelectronic packaging with bond elements to encapsulation surfaceINVENSAS CORP·Filed 2012·Granted Nov 4, 2014·137 cites·71 claims
- 0299US8372741B1Method for package-on-package assembly with wire bonds to encapsulation surfaceINVENSAS CORP·Filed 2012·Granted Feb 12, 2013·121 cites·25 claims
- 0398US9502390B2BVA interposerINVENSAS CORP·Filed 2013·Granted Nov 22, 2016·59 cites·27 claims
- 0498US9349706B2Method for package-on-package assembly with wire bonds to encapsulation surfaceINVENSAS CORP·Filed 2013·Granted May 24, 2016·47 cites·4 claims
- 0598US9105483B2Package-on-package assembly with wire bond viasCHAU ELLIS·Filed 2012·Granted Aug 11, 2015·60 cites·29 claims
- 0698US9095074B2Structure for microelectronic packaging with bond elements to encapsulation surfaceINVENSAS CORP·Filed 2014·Granted Jul 28, 2015·66 cites·20 claims
- 0798US9041227B2Package-on-package assembly with wire bond viasINVENSAS CORP·Filed 2013·Granted May 26, 2015·37 cites·16 claims
- 0898US8836136B2Package-on-package assembly with wire bond viasCHAU ELLIS·Filed 2012·Granted Sep 16, 2014·84 cites·29 claims
- 0998US8772152B2Method for package-on-package assembly with wire bonds to encapsulation surfaceINVENSAS CORP·Filed 2013·Granted Jul 8, 2014·56 cites·20 claims
- 1098US8404520B1Package-on-package assembly with wire bond viasCHAU ELLIS·Filed 2012·Granted Mar 26, 2013·112 cites·27 claims
- 1196US9691679B2Method for package-on-package assembly with wire bonds to encapsulation surfaceINVENSAS CORP·Filed 2016·Granted Jun 27, 2017·12 cites·3 claims
- 1294US7923349B2Wafer level surface passivation of stackable integrated circuit chipsVERTICAL CIRCUITS INC·Filed 2008·Granted Apr 12, 2011·37 cites·25 claims
- 1392US7863159B2Semiconductor die separation methodVERTICAL CIRCUITS INC·Filed 2008·Granted Jan 4, 2011·21 cites·24 claims
- 1492US2025118705A1Package-on-package assembly with wire bond viasADEIA SEMICONDUCTOR TECH LLC·Filed 2024·Application pending·0 cites
- 1591US9412714B2Wire bond support structure and microelectronic package including wire bonds therefromINVENSAS CORP·Filed 2014·Granted Aug 9, 2016·11 cites·10 claims
- 1689US10297582B2BVA interposerINVENSAS CORP·Filed 2015·Granted May 21, 2019·6 cites·11 claims
- 1789US9761558B2Package-on-package assembly with wire bond viasINVENSAS CORP·Filed 2015·Granted Sep 12, 2017·4 cites·16 claims
- 1885US12211821B2Package-on-package assembly with wire bond viasADEIA SEMICONDUCTOR TECH LLC·Filed 2023·Granted Jan 28, 2025·0 cites·19 claims
- 1984US9087815B2Off substrate kinking of bond wireINVENSAS CORP·Filed 2013·Granted Jul 21, 2015·8 cites·20 claims
- 2082US9615456B2Microelectronic assembly for microelectronic packaging with bond elements to encapsulation surfaceINVENSAS CORP·Filed 2015·Granted Apr 4, 2017·3 cites·20 claims
- 2181US8680687B2Electrical interconnect for die stacked in zig-zag configurationCO REYNALDO·Filed 2010·Granted Mar 25, 2014·7 cites·31 claims
- 2278US11735563B2Package-on-package assembly with wire bond viasINVENSAS LLC·Filed 2021·Granted Aug 22, 2023·0 cites·8 claims
- 2378US9825002B2Flipped die stackINVENSAS CORP·Filed 2016·Granted Nov 21, 2017·3 cites·12 claims
- 2478US9252122B2Package-on-package assembly with wire bond viasINVENSAS CORP·Filed 2013·Granted Feb 2, 2016·2 cites·15 claims
- 2576US9947641B2Wire bond support structure and microelectronic package including wire bonds therefromINVENSAS CORP·Filed 2016·Granted Apr 17, 2018·2 cites·20 claims
- 2676US9153517B2Electrical connector between die pad and z-interconnect for stacked die assembliesCO REYNALDO·Filed 2011·Granted Oct 6, 2015·5 cites·19 claims
- 2775US11189595B2Package-on-package assembly with wire bond viasINVENSAS CORP·Filed 2020·Granted Nov 30, 2021·0 cites·20 claims
- 2875US9082753B2Severing bond wire by kinking and twistingINVENSAS CORP·Filed 2014·Granted Jul 14, 2015·3 cites·19 claims
- 2971US9508689B2Electrical connector between die pad and z-interconnect for stacked die assembliesINVENSAS CORP·Filed 2015·Granted Nov 29, 2016·2 cites·18 claims
- 3068US8884403B2Semiconductor die array structureCO REYNALDO·Filed 2010·Granted Nov 11, 2014·2 cites·8 claims
- 3167US8324081B2Wafer level surface passivation of stackable integrated circuit chipsMCELREA SIMON J S·Filed 2011·Granted Dec 4, 2012·2 cites·9 claims
- 3262US10756049B2Package-on-package assembly with wire bond viasINVENSAS CORP·Filed 2017·Granted Aug 25, 2020·0 cites·16 claims
- 3353US10806036B2Pressing of wire bond wire tips to provide bent-over tipsINVENSAS CORP·Filed 2018·Granted Oct 13, 2020·0 cites·5 claims
- 3450US9893033B2Off substrate kinking of bond wireINVENSAS CORP·Filed 2016·Granted Feb 13, 2018·0 cites·21 claims
- 3548US9888579B2Pressing of wire bond wire tips to provide bent-over tipsINVENSAS CORP·Filed 2015·Granted Feb 6, 2018·0 cites·9 claims
- 3641US9761554B2Ball bonding metal wire bond wires to metal padsINVENSAS CORP·Filed 2015·Granted Sep 12, 2017·0 cites·3 claims
- 3741US9530749B2Coupling of side surface contacts to a circuit platformINVENSAS CORP·Filed 2015·Granted Dec 27, 2016·0 cites·13 claims
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