Inventor

KONONCHUK OLEG

FR70 patents

⚠️ This page may combine multiple inventors who share the name “KONONCHUK OLEG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KONONCHUK OLEG

SOITEC SILICON ON INSULATOR

Methods for manufacturing compound-material wafers and for recycling used donor substrates

Substrate for a temperature-compensated surface acoustic wave device or volume acoustic wave device

Method for producing a semiconductor-on-insulator structure

Method of revealing crystalline defects in a bulk substrate

Method for manufacturing compound material wafers and corresponding compound material wafer

Structure for radio-frequency applications

Method for producing a semiconductor-on-insulator structure

Substrate for a temperature-compensated surface acoustic wave device or volume acoustic wave device

Substrate for a temperature-compensated surface acoustic wave device or volume acoustic wave device

Structure for radiofrequency applications

Method for measuring thickness variations in a layer of a multilayer semiconductor structure

Structures for radiofrequency applications and related methods

Structure for radiofrequency applications

Substrate for a front-side-type image sensor and method for producing such a substrate

Process, stack and assembly for separating a structure from a substrate by electromagnetic radiation

Pseudo-substrate with improved efficiency of usage of single crystal material

Pseudo-substrate with improved efficiency of usage of single crystal material

Patterned thin SOI

Method of fabrication of highly heat dissipative substrates

Semiconductor on insulator structure for a front side type imager

Substrate for a temperature-compensated surface acoustic wave device or volume acoustic wave device

System for fracturing a plurality of wafer assemblies

Structures for radiofrequency applications and related methods

Semiconductor-on-insulator substrate for rf applications

Method of manufacturing a semiconductor on insulator type structure, notably for a front side type imager

Semiconductor-on-insulator substrate for RF applications

Method and apparatus for measuring a lifetime of charge carriers

Method for detecting the splitting of a substrate weakened by implanting atomic species

Substrate for a front-side-type image sensor and method for producing such a substrate

Substrates including useful layers

Substrate for front side type imager and method of manufacturing such a substrate

Process to dissolve the oxide layer in the peripheral ring of a structure of semiconductor-on-insulator type

Hybrid structure for a surface acoustic wave device

Structure for radio-frequency applications

Hybrid structure for a surface acoustic wave device

Structure comprising single-crystal semiconductor islands and process for making such a structure

Support substrate made of silicon suitable for radiofrequency applications and associated manufacturing method

Removable structure and removal method using the structure

Holding device for an assembly that is to be fractured

Method for transferring a useful layer from a donor substrate onto a support substrate by applying a predetermined stress

Method for transferring a useful layer onto a support substrate

Process for smoothing the surface of a semiconductor-on-insulator substrate

Vertical furnace with device for trapping contaminants

KONONCHUK OLEG

Method of manufacturing a base substrate for a semi-conductor on insulator type substrate

Relaxation of a strained material layer with application of a stiffener

CENTRE NAT RECH SCIENT

Carrier for a semiconductor structure

COMMISSARIAT ENERGIE ATOMIQUE

Method for transferring a useful layer

RADU IONUT

Method for manufacturing heterostructures

LANDRU DIDIER

Electronic device for radiofrequency or power applications and process for manufacturing such a device

VEYTIZOU CHRISTELLE

Process for locally dissolving the oxide layer in a semiconductor-on-insulator type structure