Inventor
HU CHIH-CHIA
TW48 patents
Patents
48 patentsUS10157867B1Dec 18, 2018
Interconnect structure and method
TAIWAN SEMICONDUCTOR MFG CO LTD39 citations94
US10312201B1Jun 4, 2019
Seal ring for hybrid-bond
TAIWAN SEMICONDUCTOR MFG CO LTD20 citations93
US11239205B2Feb 1, 2022
Integrating passive devices in package structures
TAIWAN SEMICONDUCTOR MFG CO LTD11 citations86
US11107779B2Aug 31, 2021
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US11094613B2Aug 17, 2021
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US11088041B2Aug 10, 2021
Semiconductor packages with shortened talking path
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US10535636B2Jan 14, 2020
Integrating passive devices in package structures
TAIWAN SEMICONDUCTOR MFG CO LTD10 citations84
US10741506B2Aug 11, 2020
Seal ring for hybrid-bond
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations83
US10620530B2Apr 14, 2020
Multiple-mask multiple-exposure lithography and masks
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations83
US11728247B2Aug 15, 2023
Manufacturing method of semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations75
US11562982B2Jan 24, 2023
Integrated circuit packages and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations75
US12223250B2Feb 11, 2025
Method of manufacturing integrated circuit having through-substrate via
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11735536B2Aug 22, 2023
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11574847B2Feb 7, 2023
Seal ring between interconnected chips mounted on an integrated circuit
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11031354B2Jun 8, 2021
Mixing organic materials into hybrid packages
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10937743B2Mar 2, 2021
Mixing organic materials into hybrid packages
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10930580B2Feb 23, 2021
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10861808B2Dec 8, 2020
Bonding structure of dies with dangling bonds
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US10784219B2Sep 22, 2020
Semiconductor device and method of manufacturing
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10515874B2Dec 24, 2019
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11482499B2Oct 25, 2022
Seal ring for hybrid-bond
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US10996558B2May 4, 2021
Multiple-mask multiple-exposure lithography and masks
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11748544B2Sep 5, 2023
Method of manufacturing integrated circuit having through-substrate via
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US11080455B1Aug 3, 2021
Layout design of integrated circuit with through-substrate via
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations71
US10510676B2Dec 17, 2019
System and method for aligned stitching
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations70
US12482772B2Nov 25, 2025
Bonding structure of dies with dangling bonds
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12362261B2Jul 15, 2025
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12300639B2May 13, 2025
Seamless bonding layers in semiconductor packages and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12293985B2May 6, 2025
Integrated circuit packages and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12170264B2Dec 17, 2024
Integrated circuit packages and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12132029B2Oct 29, 2024
Integrating passive devices in package structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12113036B2Oct 8, 2024
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12080629B2Sep 3, 2024
Manufacturing method of semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11908817B2Feb 20, 2024
Bonding structure of dies with dangling bonds
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11854918B2Dec 26, 2023
Seal ring between interconnected chips mounted on an integrated circuit
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11791243B2Oct 17, 2023
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11462458B2Oct 4, 2022
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12476206B2Nov 18, 2025
Seal ring for hybrid-bond
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12044977B2Jul 23, 2024
Multiple-mask multiple-exposure lithography and masks
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11916031B2Feb 27, 2024
Semiconductor device and method of manufacturing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11756901B2Sep 12, 2023
Seal ring for hybrid-bond
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11726408B2Aug 15, 2023
Multiple-mask multiple-exposure lithography and masks
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11402747B2Aug 2, 2022
Multiple-mask multiple-exposure lithography and masks
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11335656B2May 17, 2022
Semiconductor device and method of manufacturing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12125820B2Oct 22, 2024
Through-dielectric vias for direct connection and method forming same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations61
US12154862B2Nov 26, 2024
System and method for aligned stitching
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US11676908B2Jun 13, 2023
System and method for aligned stitching
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US12588482B2Mar 24, 2026
Method for forming semiconductor redistribution structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52