Inventor · disambiguated record
Roseanne Duca
Also filed as: DUCA ROSEANNE
8 granted patents·3 pending applications·19 citations·filing 2013–2024
79Inventor score
Files withSTMICROELECTRONICS (MALTA) LTD4ST MICROELECTRONICS INT NV2ST MICROELECTRONICS SRL2ST MICROELECTRONICS GRENOBLE 21ST MICROELECTRONICS PTE LTD1
Top patents by PatentIndex Score
11 records- 0191US9449912B1Integrated circuit (IC) card having an IC module and reduced bond wire stress and method of formingST MICROELECTRONICS PTE LTD·Filed 2015·Granted Sep 20, 2016·11 cites·24 claims
- 0279US9620438B2Electronic device with heat dissipaterSTMICROELECTRONICS (MALTA) LTD·Filed 2015·Granted Apr 11, 2017·5 cites·23 claims
- 0376US10600704B2Electronic device comprising a support substrate and an encapsulating cover for an electronic componentST MICROELECTRONICS GRENOBLE 2·Filed 2018·Granted Mar 24, 2020·2 cites·11 claims
- 0467US12148628B2Semiconductor device and corresponding methodST MICROELECTRONICS SRL·Filed 2022·Granted Nov 19, 2024·0 cites·13 claims
- 0560US11443958B2Semiconductor device and corresponding methodST MICROELECTRONICS SRL·Filed 2020·Granted Sep 13, 2022·0 cites·21 claims
- 0660US9257372B2Surface mount package for a semiconductor integrated device, related assembly and manufacturing processSTMICROELECTRONICS MALTA LTD·Filed 2013·Granted Feb 9, 2016·1 cites·16 claims
- 0760US2025112107A1Heat sink, slug, or spreader and method of manufacturing the sameST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 0856US12494419B2Integrated circuit package with warpage control using cavity formed in laminated substrate below the integrated circuit dieSTMICROELECTRONICS MALTA LTD·Filed 2022·Granted Dec 9, 2025·0 cites·24 claims
- 0954US10892201B2Electronic device comprising a support substrate and an encapsulating cover for an electronic componentSTMICROELECTRONCIS GRENOBLE 2 SAS·Filed 2020·Granted Jan 12, 2021·0 cites·11 claims
- 1054US2024038610A1Semiconductor packaging with transparency and method of manufacturing the sameSTMICROELECTRONICS MALTA LTD·Filed 2023·Application pending·0 cites
- 1151US2024228264A9Decoupling method for semiconductor deviceST MICROELECTRONICS INT NV·Filed 2022·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →