Inventor
CHEN YU-RUEI
TW28 patents
⚠️ This page may combine multiple inventors who share the name “CHEN YU-RUEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
26 patentsUS10971676B2Apr 6, 2021
Magnetoresistive random access memory having a ring of magnetic tunneling junction region surrounding an array region
UNITED MICROELECTRONICS CORP4 citations84
US10566520B2Feb 18, 2020
Magnetoresistive random access memory
UNITED MICROELECTRONICS CORP3 citations84
US10374006B1Aug 6, 2019
Magnetic random access memory cell structure
UNITED MICROELECTRONICS CORP8 citations84
US11877520B2Jan 16, 2024
Magnetoresistive random access memory having a ring of magnetic tunneling junction region surrounding an array region
UNITED MICROELECTRONICS CORP1 citations73
US10930839B2Feb 23, 2021
Magnetoresistive random access memory having a ring of magnetic tunneling junction region surrounding an array region
UNITED MICROELECTRONICS CORP2 citations73
US10153265B1Dec 11, 2018
Dummy cell arrangement and method of arranging dummy cells
UNITED MICROELECTRONICS CORP3 citations73
US10714466B1Jul 14, 2020
Layout pattern for magnetoresistive random access memory
UNITED MICROELECTRONICS CORP4 citations70
US12268098B2Apr 1, 2025
Magnetoresistive random access memory having a ring of magnetic tunneling junction region surrounding an array region
UNITED MICROELECTRONICS CORP0 citations62
US12087666B2Sep 10, 2024
Semiconductor device
UNITED MICROELECTRONICS CORP0 citations62
US11611035B2Mar 21, 2023
Magnetoresistive random access memory having a ring of magnetic tunneling junction region surrounding an array region
UNITED MICROELECTRONICS CORP0 citations62
US11552001B2Jan 10, 2023
Semiconductor device
UNITED MICROELECTRONICS CORP0 citations62
US10903143B1Jan 26, 2021
Semiconductor device
UNITED MICROELECTRONICS CORP0 citations62
US12328898B2Jun 10, 2025
High voltage semiconductor device including buried oxide layer
UNITED MICROELECTRONICS CORP0 citations61
US12243839B2Mar 4, 2025
Bonded semiconductor structure utilizing concave/convex profile design for bonding pads
UNITED MICROELECTRONICS CORP0 citations61
US12040396B2Jul 16, 2024
High voltage semiconductor device including buried oxide layer
UNITED MICROELECTRONICS CORP0 citations61
US11935854B2Mar 19, 2024
Method for forming bonded semiconductor structure utilizing concave/convex profile design for bonding pads
UNITED MICROELECTRONICS CORP0 citations61
US11869953B2Jan 9, 2024
High voltage transistor device and method for fabricating the same
UNITED MICROELECTRONICS CORP0 citations61
US11721702B2Aug 8, 2023
Fabrication method of fin transistor
UNITED MICROELECTRONICS CORP0 citations61
US11640949B2May 2, 2023
Bonded semiconductor structure utilizing concave/convex profile design for bonding pads
UNITED MICROELECTRONICS CORP0 citations61
US11626515B2Apr 11, 2023
High voltage semiconductor device including buried oxide layer and method for forming the same
UNITED MICROELECTRONICS CORP0 citations61
US11476343B2Oct 18, 2022
High voltage transistor device and method for fabricating the same
UNITED MICROELECTRONICS CORP0 citations61
US11417685B2Aug 16, 2022
Fin transistor structure and fabrication method thereof
UNITED MICROELECTRONICS CORP1 citations61
US12262555B2Mar 25, 2025
Semiconductor device and method of fabricating the same
UNITED MICROELECTRONICS CORP0 citations59
US10854592B2Dec 1, 2020
Dummy cell arrangement and method of arranging dummy cells
UNITED MICROELECTRONICS CORP0 citations52
US10658241B2May 19, 2020
Method of fabricating integrated circuit
UNITED MICROELECTRONICS CORP0 citations52
US10355048B1Jul 16, 2019
Isolation structure of semiconductor device and method for fabricating the same
UNITED MICROELECTRONICS CORP0 citations52