Inventor · disambiguated record
Jin-Neng Wu
Also filed as: WU JIN · WU JIN NENG
11 granted patents·10 pending applications·10 citations·filing 2004–2024
82Inventor score
Top patents by PatentIndex Score
21 records- 0177US12215018B2Method for manufacturing package structureWINBOND ELECTRONICS CORP·Filed 2024·Granted Feb 4, 2025·0 cites·18 claims
- 0270US9535775B2Session-based remote management system and load balance controlling methodIND TECH RES INST·Filed 2014·Granted Jan 3, 2017·3 cites·15 claims
- 0368US11970388B2Package structure and method for manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2021·Granted Apr 30, 2024·0 cites·20 claims
- 0468US11658138B2Semiconductor device including uneven contact in passivation layerWINBOND ELECTRONICS CORP·Filed 2022·Granted May 23, 2023·0 cites·9 claims
- 0563US11309267B2Semiconductor device including uneven contact in passivation layer and method of manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2020·Granted Apr 19, 2022·0 cites·9 claims
- 0662US11610857B2Method of manufacturing circuit structureWINBOND ELECTRONICS CORP·Filed 2021·Granted Mar 21, 2023·0 cites·10 claims
- 0760US2025254979A1Capacitor structureWINBOND ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0858US2025118631A1Semiconductor structure and method for fabricating the sameWINBOND ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0958US2015168876A1Process for fabrication of seamless uv cured intermediate transfer belts (itb)XEROX CORP·Filed 2015·Application pending·0 cites
- 1058US2025287621A13d capacitance structure and manufacture method thereofWINBOND ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1157US8938495B2Remote management system with adaptive session management mechanismIND TECH RES INST·Filed 2013·Granted Jan 20, 2015·1 cites·26 claims
- 1257US8539054B2Remote interface apparatus, control system, and the method thereofHUANG YUNG SHUN·Filed 2008·Granted Sep 17, 2013·4 cites·25 claims
- 1355US8819239B2Distributed resource management systems and methods for resource management thereofWU JIN-NENG·Filed 2012·Granted Aug 26, 2014·2 cites·16 claims
- 1455US2024274565A1Die package structure and method for forming the sameWINBOND ELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 1550US2020251435A1Circuit structure and method of manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2019·Application pending·0 cites
- 1646US11063010B2Redistribution layer (RDL) structure and method of manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2019·Granted Jul 13, 2021·0 cites·14 claims
- 1744US2022059483A1Conductive pillar bump and manufacturing method thereforeWINBOND ELECTRONICS CORP·Filed 2020·Application pending·0 cites
- 1841US11145627B2Semiconductor package and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2019·Granted Oct 12, 2021·0 cites·10 claims
- 1941US2020350268A1Wire bonding structure and method of manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2019·Application pending·0 cites
- 2041US2010146104A1System and method for detecting a remote apparatusIND TECH RES INST·Filed 2009·Application pending·0 cites
- 2135US2006110670A1In situ method for passivating the surface of a photoreceptor substrateWU JIN·Filed 2004·Application pending·0 cites
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