Inventor
HIRAMATSU HIROAKI
JP24 patents
⚠️ This page may combine multiple inventors who share the name “HIRAMATSU HIROAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KOKUSAI ELECTRIC CORP
16 patentsUSD888196SJun 23, 2020
Gas nozzle for substrate processing apparatus
KOKUSAI ELECTRIC CORP16 citations85
US10907253B2Feb 2, 2021
Method of manufacturing semiconductor device, substrate processing apparatus and recording medium
KOKUSAI ELECTRIC CORP4 citations72
US10640872B2May 5, 2020
Substrate processing apparatus and method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP2 citations72
US10584419B2Mar 10, 2020
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP2 citations72
US11261528B2Mar 1, 2022
Substrate processing apparatus and method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP5 citations71
US12065741B2Aug 20, 2024
Substrate processing apparatus and method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP0 citations62
US11952664B2Apr 9, 2024
Substrate processing apparatus and method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP0 citations62
US11365482B2Jun 21, 2022
Substrate processing apparatus and method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP0 citations62
US12540388B2Feb 3, 2026
Method of cleaning member in process container, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations61
US12365987B2Jul 22, 2025
Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations61
US12053805B2Aug 6, 2024
Method of cleaning member in process container, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations61
US11591694B2Feb 28, 2023
Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations61
US11047048B2Jun 29, 2021
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations61
US11967501B2Apr 23, 2024
Substrate processing apparatus and method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP0 citations60
US11476113B2Oct 18, 2022
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP1 citations59
US11170995B2Nov 9, 2021
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations51
HITACHI INT ELECTRIC INC
5 patentsUSD853979SJul 16, 2019
Reaction tube
HITACHI INT ELECTRIC INC10 citations83
US11542601B2Jan 3, 2023
Substrate processing apparatus and method of manufacturing semiconductor device
HITACHI INT ELECTRIC INC2 citations73
USD889596SJul 7, 2020
Gas nozzle for substrate processing apparatus
HITACHI INT ELECTRIC INC5 citations72
US10388512B2Aug 20, 2019
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC1 citations62
US9587314B2Mar 7, 2017
Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium
HITACHI INT ELECTRIC INC1 citations52