Inventor · disambiguated record
Keith Gann
Also filed as: GANN KEITH · GANN KEITH D
13 granted patents·4 pending applications·191 citations·filing 2001–2011
91Inventor score
Top patents by PatentIndex Score
17 records- 0190US6806559B2Method and apparatus for connecting vertically stacked integrated circuit chipsIRVINE SENSORS CORP·Filed 2002·Granted Oct 19, 2004·63 cites·40 claims
- 0290US6706971B2Stackable microcircuit layer formed from a plastic encapsulated microcircuitIRVINE SENSORS CORP·Filed 2002·Granted Mar 16, 2004·70 cites·6 claims
- 0382US7265579B2Field programmable gate array incorporating dedicated memory stacksIRVINE SENSORS CORP·Filed 2005·Granted Sep 4, 2007·10 cites·4 claims
- 0481US7649386B2Field programmable gate array utilizing dedicated memory stacks in a vertical layer formatOZGUZ VOLKAN H·Filed 2007·Granted Jan 19, 2010·10 cites·40 claims
- 0580US8012803B2Vertically stacked pre-packaged integrated circuit chipsAPROLASE DEV CO LLC·Filed 2010·Granted Sep 6, 2011·5 cites·36 claims
- 0677US6856167B2Field programmable gate array with a variably wide word width memoryIRVINE SENSORS CORP·Filed 2003·Granted Feb 15, 2005·22 cites·34 claims
- 0770US7902879B2Field programmable gate array utilizing dedicated memory stacks in a vertical layer formatAPROLASE DEV CO LLC·Filed 2009·Granted Mar 8, 2011·4 cites·32 claims
- 0862US7982300B2Stackable layer containing ball grid array packageAPROLASE DEV CO LLC·Filed 2010·Granted Jul 19, 2011·1 cites·20 claims
- 0957US7714426B1Ball grid array package format layers and structureGANN KEITH·Filed 2007·Granted May 11, 2010·1 cites·29 claims
- 1051US2007102803A1Method for making stacked integrated circuits (ICs) using prepackaged partsIRVINE SENSORS CORP·Filed 2006·Application pending·0 cites
- 1150US7174627B2Method of fabricating known good dies from packaged integrated circuitsIRVINE SENSORS CORP·Filed 2003·Granted Feb 13, 2007·4 cites·12 claims
- 1249US8835218B2Stackable layer containing ball grid array packageGANN KEITH·Filed 2011·Granted Sep 16, 2014·0 cites·25 claims
- 1340US7777321B2Stacked microelectronic layer and module with three-axis channel T-connectsGANN KEITH D·Filed 2005·Granted Aug 17, 2010·0 cites·23 claims
- 1440US2003221313A1Method for making stacked integrated circuits (ICs) using prepackaged partsFiled 2003·Application pending·0 cites
- 1538US7872339B2Vertically stacked pre-packaged integrated circuit chipsGANN KEITH·Filed 2004·Granted Jan 18, 2011·1 cites·36 claims
- 1638US2010009499A1Stacked microelectronic layer and module with three-axis channel t-connectsGANN KEITH D·Filed 2009·Application pending·0 cites
- 1734US2002100600A1Stackable microcircuit layer formed from a plastic encapsulated microcircuit and method of making the sameFiled 2001·Application pending·0 cites
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