Inventor
KAMEHARA NOBUO
35 patents
Patents
35 patentsUS5643831AJul 1, 1997
Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device
FUJITSU LTD231 citations98
US6025258AFeb 15, 2000
Method for fabricating solder bumps by forming solder balls with a solder ball forming member
FUJITSU LTD94 citations97
US6193905B1Feb 27, 2001
Immersion cooling coolant
FUJITSU LTD60 citations96
US5349499ASep 20, 1994
Immersion cooling coolant and electronic device using this coolant
FUJITSU LTD53 citations96
US4642148AFeb 10, 1987
Method for producing a multilayer ceramic circuit board
FUJITSU LTD49 citations96
US6528346B2Mar 4, 2003
Bump-forming method using two plates and electronic device
FUJITSU LTD24 citations92
US5906481AMay 25, 1999
Piezoelectric fluid pump
FUJITSU LTD41 citations92
US5659004AAug 19, 1997
Epoxy resin composition
FUJITSU LTD31 citations92
US5593526AJan 14, 1997
Process for preparing a multi-layer wiring board
FUJITSU LTD36 citations92
US5458709AOct 17, 1995
Process for manufacturing multi-layer glass ceramic substrate
FUJITSU LTD29 citations92
US5287620AFeb 22, 1994
Process of producing multiple-layer glass-ceramic circuit board
FUJITSU LTD30 citations92
US5038571AAug 13, 1991
Production and use of coolant in cryogenic devices
FUJITSU LTD25 citations92
US4954480ASep 4, 1990
Multi-layer superconducting circuit substrate and process for manufacturing same
FUJITSU LTD49 citations92
US4504339AMar 12, 1985
Method for producing multilayered glass-ceramic structure with copper-based conductors therein
FUJITSU LTD35 citations92
US4313026AJan 26, 1982
Multilayer circuit boards
FUJITSU LTD40 citations92
US5443786AAug 22, 1995
Composition for the formation of ceramic vias
FUJITSU LTD19 citations82
US4761325AAug 2, 1988
Multilayer ceramic circuit board
FUJITSU LTD18 citations82
US4346516AAug 31, 1982
Method of forming a ceramic circuit substrate
FUJITSU LTD24 citations81
US5141917AAug 25, 1992
Multilayer deposition method for forming Pb-doped Bi-Sr-Ca-Cu-O Superconducting films
FUJITSU LTD7 citations74
US6156259ADec 5, 2000
Method of manufacturing piezoelectric materials
FUJITSU LTD11 citations73
US5962955AOct 5, 1999
Piezoelectric device and method for fabricating the same, and ink jet printer head and method for fabricating the same
FUJITSU LTD7 citations73
US5683529ANov 4, 1997
Process of producing aluminum nitride multiple-layer circuit board
FUJITSU LTD9 citations73
US5275889AJan 4, 1994
Multi-layer wiring board
FUJITSU LTD13 citations73
US5196384AMar 23, 1993
Method for preparing green sheets
FUJITSU LTD9 citations73
US5081070AJan 14, 1992
Superconducting circuit board and paste adopted therefor
FUJITSU LTD17 citations73
US5015314AMay 14, 1991
Method for production of ceramic circuit board
FUJITSU LTD10 citations73
US4217337AAug 12, 1980
Process for manufacturing an alumina substrate by acid purifying a prefired substrate before final firing
FUJITSU LTD16 citations73
US4679320AJul 14, 1987
Process for producing multilayer ceramic circuit board with copper
FUJITSU LTD11 citations71
US5629269AMay 13, 1997
Process for forming oxide superconducting films with a plurality of metal buffer layers
FUJITSU LTD2 citations63
US5585332ADec 17, 1996
Process for preparing a perovskite Bi-containing superconductor film
FUJITSU LTD3 citations63
US5306702AApr 26, 1994
Process for producing Bi-Pb-Sr-Ca-Cu-O superconducting films
FUJITSU LTD5 citations63
US5049541ASep 17, 1991
Process for preparing superconductor
FUJITSU LTD6 citations63
US6097412AAug 1, 2000
Ink jet printer head and method for fabricating the same including a piezoelectric device with a multilayer body having a pair of high rigidity plates provided on the side walls
FUJITSU LTD5 citations62
US5286713AFeb 15, 1994
Method for manufacturing an oxide superconducting circuit board by printing
FUJITSU LTD5 citations60
US5312803AMay 17, 1994
Process for producing Bi- and Pb-containing oxide superconducting wiring films
FUJITSU LTD1 citations52