Inventor
NIWA KOICHI
31 patents
⚠️ This page may combine multiple inventors who share the name “NIWA KOICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FUJITSU LTD
25 patentsUS6193905B1Feb 27, 2001
Immersion cooling coolant
FUJITSU LTD60 citations96
US5349499ASep 20, 1994
Immersion cooling coolant and electronic device using this coolant
FUJITSU LTD53 citations96
US4704658ANov 3, 1987
Evaporation cooling module for semiconductor devices
FUJITSU LTD122 citations96
US4642148AFeb 10, 1987
Method for producing a multilayer ceramic circuit board
FUJITSU LTD49 citations96
US5593526AJan 14, 1997
Process for preparing a multi-layer wiring board
FUJITSU LTD36 citations92
US5287620AFeb 22, 1994
Process of producing multiple-layer glass-ceramic circuit board
FUJITSU LTD30 citations92
US5038571AAug 13, 1991
Production and use of coolant in cryogenic devices
FUJITSU LTD25 citations92
US4954480ASep 4, 1990
Multi-layer superconducting circuit substrate and process for manufacturing same
FUJITSU LTD49 citations92
US4504339AMar 12, 1985
Method for producing multilayered glass-ceramic structure with copper-based conductors therein
FUJITSU LTD35 citations92
US4313026AJan 26, 1982
Multilayer circuit boards
FUJITSU LTD40 citations92
US4237606ADec 9, 1980
Method of manufacturing multilayer ceramic board
FUJITSU LTD51 citations90
US5443786AAug 22, 1995
Composition for the formation of ceramic vias
FUJITSU LTD19 citations82
US4761325AAug 2, 1988
Multilayer ceramic circuit board
FUJITSU LTD18 citations82
US4346516AAug 31, 1982
Method of forming a ceramic circuit substrate
FUJITSU LTD24 citations81
US5141917AAug 25, 1992
Multilayer deposition method for forming Pb-doped Bi-Sr-Ca-Cu-O Superconducting films
FUJITSU LTD7 citations74
US5275889AJan 4, 1994
Multi-layer wiring board
FUJITSU LTD13 citations73
US5081070AJan 14, 1992
Superconducting circuit board and paste adopted therefor
FUJITSU LTD17 citations73
US5015314AMay 14, 1991
Method for production of ceramic circuit board
FUJITSU LTD10 citations73
US4460916AJul 17, 1984
Ceramic substrate with integrated circuit bonded thereon
FUJITSU LTD12 citations73
US5629269AMay 13, 1997
Process for forming oxide superconducting films with a plurality of metal buffer layers
FUJITSU LTD2 citations63
US5585332ADec 17, 1996
Process for preparing a perovskite Bi-containing superconductor film
FUJITSU LTD3 citations63
US5306702AApr 26, 1994
Process for producing Bi-Pb-Sr-Ca-Cu-O superconducting films
FUJITSU LTD5 citations63
US5049541ASep 17, 1991
Process for preparing superconductor
FUJITSU LTD6 citations63
US5286713AFeb 15, 1994
Method for manufacturing an oxide superconducting circuit board by printing
FUJITSU LTD5 citations60
US5312803AMay 17, 1994
Process for producing Bi- and Pb-containing oxide superconducting wiring films
FUJITSU LTD1 citations52
DAI ICHI KOGYO SEIYAKU CO LTD
4 patentsUS5047477ASep 10, 1991
Method of producing imide bond-containing resins and flame retardants comprising said resins
DAI ICHI KOGYO SEIYAKU CO LTD3 citations62
US4883843ANov 28, 1989
Imide bond-containing resins and flame retardants comprising said resins
DAI ICHI KOGYO SEIYAKU CO LTD5 citations61
US5086114AFeb 4, 1992
Method of producing imide bond-containing resins
DAI ICHI KOGYO SEIYAKU CO LTD1 citations51
US5072000ADec 10, 1991
Method of producing imide bond-containing compounds and flame retardants comprising such compounds
DAI ICHI KOGYO SEIYAKU CO LTD0 citations51