Inventor · disambiguated record
Hisakazu Miyajima
Also filed as: MIYAJIMA HISAKAZU
9 granted patents·183 citations·filing 1991–2007
89Inventor score
Top patents by PatentIndex Score
9 records- 0186US8080869B2Wafer level package structure and production method thereforOKUDO TAKAFUMI·Filed 2006·Granted Dec 20, 2011·21 cites·13 claims
- 0286US6848320B2Mechanical deformation amount sensorMATSUSHITA ELECTRIC WORKS LTD·Filed 2003·Granted Feb 1, 2005·74 cites·16 claims
- 0384US7554340B2Capacitive sensorPANASONIC ELEC WORKS CO LTD·Filed 2007·Granted Jun 30, 2009·13 cites·6 claims
- 0482US7674638B2Sensor device and production method thereforPANASONIC ELEC WORKS CO LTD·Filed 2006·Granted Mar 9, 2010·13 cites·25 claims
- 0580US8176782B2Capacitive sensorFURUKUBO EIICHI·Filed 2007·Granted May 15, 2012·21 cites·1 claims
- 0676US7107847B2Semiconductor acceleration sensor and method of manufacturing the sameMATSUSHITA ELECTRIC WORKS LTD·Filed 2004·Granted Sep 19, 2006·21 cites·11 claims
- 0767US8067769B2Wafer level package structure, and sensor device obtained from the same package structureOKUDO TAKAFUMI·Filed 2006·Granted Nov 29, 2011·4 cites·22 claims
- 0851US5151602ASemiconductor relay circuit using photovoltaic diodesMATSUSHITA ELECTRIC WORKS LTD·Filed 1991·Granted Sep 29, 1992·16 cites·5 claims
- 0939US8026594B2Sensor device and production method thereforPANASONIC ELEC WORKS CO LTD·Filed 2006·Granted Sep 27, 2011·0 cites·10 claims
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