Inventor
WEBER PATRICK O
US19 patents
⚠️ This page may combine multiple inventors who share the name “WEBER PATRICK O”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HESTIA TECHNOLOGIES INC
17 patentsUS6038136AMar 14, 2000
Chip package with molded underfill
HESTIA TECHNOLOGIES INC219 citations98
US5798014AAug 25, 1998
Methods of making multi-tier laminate substrates for electronic device packaging
HESTIA TECHNOLOGIES INC183 citations98
US6324069B1Nov 27, 2001
Chip package with molded underfill
HESTIA TECHNOLOGIES INC95 citations97
US5609889AMar 11, 1997
Apparatus for encapsulating electronic packages
HESTIA TECHNOLOGIES INC98 citations97
US6560122B2May 6, 2003
Chip package with molded underfill
HESTIA TECHNOLOGIES INC47 citations96
US5776512AJul 7, 1998
Apparatus for encapsulating electronic packages
HESTIA TECHNOLOGIES INC45 citations96
US5622588AApr 22, 1997
Methods of making multi-tier laminate substrates for electronic device packaging
HESTIA TECHNOLOGIES INC75 citations96
US5652463AJul 29, 1997
Transfer modlded electronic package having a passage means
HESTIA TECHNOLOGIES INC48 citations94
US7049166B2May 23, 2006
Methods and apparatus for making integrated circuit package including opening exposing portion of the IC
HESTIA TECHNOLOGIES INC51 citations92
US6495083B2Dec 17, 2002
Method of underfilling an integrated circuit chip
HESTIA TECHNOLOGIES INC20 citations92
US5929522AJul 27, 1999
Semiconductor non-laminate package and method
HESTIA TECHNOLOGIES INC19 citations92
US5728248AMar 17, 1998
Method for making a multi-tier laminate substrate with internal heat spreader
HESTIA TECHNOLOGIES INC28 citations92
US5689137ANov 18, 1997
Method for transfer molding standard electronic packages and apparatus formed thereby
HESTIA TECHNOLOGIES INC23 citations92
US5597643AJan 28, 1997
Multi-tier laminate substrate with internal heat spreader
HESTIA TECHNOLOGIES INC40 citations92
US6128195AOct 3, 2000
Transfer molded PCMCIA standard cards
HESTIA TECHNOLOGIES INC37 citations90
US6316291B1Nov 13, 2001
Method of fabricating a non-laminate carrier substrate utilizing a mold
HESTIA TECHNOLOGIES INC10 citations73
US5766986AJun 16, 1998
Method of transfer molding electronic packages and packages produced thereby
HESTIA TECHNOLOGIES INC14 citations71